New Concept of TSV Formation Methodology Using Directed Self-Assembly (DSA)

被引：0
|
作者：
Fukushima, Takafumi [1 ,2 ]
Murugesan, Mariappan [2 ]
Ohsaki, Shin [2 ]
Hashimoto, Hiroyuki [2 ]
Bea, Jichoel [2 ]
Lee, Kang-Wook [2 ]
Tanaka, Tetsu [1 ,3 ]
Koyanagi, Mitsumasa [2 ]
机构：
[1] Tohoku Univ, Grad Sch Engn, Dept Mech Syst Engn, Aoba Ku, 6-6-12 Aza Aoba, Sendai, Miyagi 9808579, Japan
[2] Tohoku Univ, New Ind Creat Hatchery Ctr, Sendai, Miyagi, Japan
[3] Tohoku Univ, Grad Sch Biomed Engn, Dept Biomed Engn, Sendai, Miyagi, Japan
来源：
2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) | 2016年
关键词：
Directed Self-Assembly (DSA); 3D Integration Technology; Through-Silicon Via (TSV); Nano metal particles; Self-Consistent Field (SCF) theory; INTEGRATION;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
A new TSV formation methodology based on advanced Directed Self-Assembly (DSA) with nanocomposites consisting of nano metal particles and block-co-polymers is proposed in this paper. Cylindrical nano-ordered structures are formed in Si deep holes through phase separation of polystyrene-block-poly methyl methacrylate polymers (PS-b-PMMA). The impact of molecular weight of the polymers, composition (PS/PMMA ratio), and phase separation temperature on the morphologies is discussed. In addition, simulation results using Self-Consistent Field (SCF) theory are introduced to make fine-pitch TSV.
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页数：4
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