Fabrication of Compliant Three-Dimensional Microstructures as Surface Coatings for Dry Contact Thermal Conductance Enhancement

被引:0
|
作者
Wasielewski, Ryan [1 ]
Cui, Jin [1 ]
Pan, Liang [1 ]
Weibel, Justin A. [1 ]
机构
[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
关键词
Thermal interface materials; Projection micro-stereolithography; Compliant materials; INTERFACE MATERIALS; METALLIC COATINGS; CHALLENGES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The thermal contact resistance between two surfaces is a pervasive hurdle to effective heat transport in avionics, telecommunications, data center, and other electronics thermal management applications. A novel concept for dry contact thermal conductance enhancement is presented that utilizes a custom-made projection micro-sterolithography (mu SL) system to fabricate 'spring-like' 3D microstructures which are used as a dry surface coating that allows conformal interface contact at low to moderate pressures (on the order of 10s of kPa or lower). We fabricate two kinds of spring structures to demonstrate viable mechanical deformation performance for such applications: 300 mu m-tall Belleville spring and 500 mu m-tall zigzag spring structures. The mechanical compliance of these heuristic microstructure designs is experimentally characterized. The compliance of these structures would allow them to conform to mating surfaces with similar to 10s of mu m waviness.
引用
收藏
页码:134 / 139
页数:6
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