A novel integration of STT-MRAM for on-chip hybrid memory by utilizing non-volatility modulation

被引:10
|
作者
Park, J. -H. [1 ]
Lee, J. [1 ]
Jeong, J. [1 ]
Pi, U. [1 ]
Kim, W. K. [1 ]
Lee, S. [1 ]
Noh, E. [1 ]
Kim, K. [1 ]
Lim, W. C. [1 ]
Kwon, S. [1 ]
Bae, B. -J. [1 ]
Kim, I. [1 ]
Ji, N. [1 ]
Lee, K. [1 ]
Shin, H. [1 ]
Han, S. H. [2 ]
Hwang, S. [2 ]
Jeong, D. [1 ]
Lee, J. [1 ]
Oh, S. C. [1 ]
Park, S. O. [1 ]
Song, Y. J. [2 ]
Jeong, G. T. [2 ]
Koh, G. H. [1 ]
Hyun, S. [1 ]
Hwang, K. [1 ]
Nam, S. W. [1 ]
Kang, H. K. [1 ]
Jung, E. S. [2 ]
机构
[1] Samsung Elect Co Ltd, Semicond R&D Ctr, Hwaseong, South Korea
[2] Samsung Elect Co Ltd, Foundry Business, Giheung, South Korea
来源
2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2019年
关键词
D O I
10.1109/iedm19573.2019.8993614
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate a novel way of integrating STT-MRAM for on-chip hybrid memory which exhibits either features of high-retention or high-speed implemented in separate zones in a single chip. For satisfying high-temperature retention requirement, tailored MTJs are shown to support > 10 year retention at 220 degrees C. For high-speed operation, critical improvements have been made in terms of TMR, short fail probability, overdrive and write error rate. The new integration provides a manufacturable way of combining diverse memory components by modulating nonvolatility of STT-MRAM without affecting within-chip distributions of critical properties.
引用
收藏
页数:4
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