Ultra-Broadband Modulator Packaging for Millimeter-Wave Applications

被引：4
|
作者：
Macario, Julien [1 ]
Mercante, Andrew [1 ]
Yao, Peng [2 ]
Zablocki, Alicia [2 ]
Shi, Shouyuan [1 ]
Prather, Dennis W. [1 ]
机构：
[1] Univ Delaware, Dept Elect & Comp Engn, Newark, DE 19716 USA
[2] Phase Sensit Innovat Inc, Newark, DE 19711 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2014年 / 62卷 / 02期
关键词：
LiNbO3; modulator; 1.0-mm connector; packaging; RF transition;
D O I：
10.1109/TMTT.2013.2295769
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper reports the RF packaging design for electrooptic modulators operating in the millimeter-wave domain and discusses the RF and optical performances of the module. An LiNbO3 phase modulator has been integrated in a compact housing offering a 1.0-mm RF coaxial input connector. A coplanar waveguide on a low dielectric-loss alumina substrate has been designed to transition the RF field from the connector to the modulator. A RF insertion loss in the 1-2.5-dB range has been measured for the module over the 70-110-GHz bandwidth. A half-wave voltage comprised between 8.6 V at dc and 20 V at 110 GHz was calculated based on the observation of the optical modulation sidebands over the entire 70-110-GHz bandwidth.
引用
收藏
页码：306 / 312
页数：7
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