Ultra-Broadband Modulator Packaging for Millimeter-Wave Applications

被引：4

作者：

Macario, Julien ^{[1
]}

Mercante, Andrew ^{[1
]}

Yao, Peng ^{[2
]}

Zablocki, Alicia ^{[2
]}

Shi, Shouyuan ^{[1
]}

Prather, Dennis W. ^{[1
]}

机构：

[1] Univ Delaware, Dept Elect & Comp Engn, Newark, DE 19716 USA

[2] Phase Sensit Innovat Inc, Newark, DE 19711 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2014年 / 62卷 / 02期

关键词：

LiNbO3; modulator; 1.0-mm connector; packaging; RF transition;

D O I：

10.1109/TMTT.2013.2295769

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports the RF packaging design for electrooptic modulators operating in the millimeter-wave domain and discusses the RF and optical performances of the module. An LiNbO3 phase modulator has been integrated in a compact housing offering a 1.0-mm RF coaxial input connector. A coplanar waveguide on a low dielectric-loss alumina substrate has been designed to transition the RF field from the connector to the modulator. A RF insertion loss in the 1-2.5-dB range has been measured for the module over the 70-110-GHz bandwidth. A half-wave voltage comprised between 8.6 V at dc and 20 V at 110 GHz was calculated based on the observation of the optical modulation sidebands over the entire 70-110-GHz bandwidth.

引用

页码：306 / 312

页数：7

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