Simulation of the loss of superconductivity in a three-dimensional model of the metal-superconductor connection

The paper presents the results of the simulation of the loss of superconductivity in superconducting tape with the soldered electrode. The model assumes the dominant nature of thermal processes initiated in the connection, and it includes a full non-linear heat transfer coefficient depending on the temperature. The simulation studies were carried out in COMSOL computing environment. The results confirmed a significant effect of variation of the process of heat transfer to the nature of the simulated phenomena. (Simulation of the loss of superconductivity in a three-dimensional model of the metal-superconductor connection)