Simulation of the loss of superconductivity in a three-dimensional model of the metal-superconductor connection

被引：0
|
作者：
Rymaszewski, Jacek [1 ]
Lebioda, Marcin [1 ]
Korzeniewska, Ewa [1 ]
机构：
[1] Tech Univ Lodz, Inst Inzynierii Syst Elekt, PL-90924 Lodz, Poland
来源：
PRZEGLAD ELEKTROTECHNICZNY | 2012年 / 88卷 / 12B期
关键词：
superconductivity; computer simulations; TEMPERATURE; PROPAGATION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper presents the results of the simulation of the loss of superconductivity in superconducting tape with the soldered electrode. The model assumes the dominant nature of thermal processes initiated in the connection, and it includes a full non-linear heat transfer coefficient depending on the temperature. The simulation studies were carried out in COMSOL computing environment. The results confirmed a significant effect of variation of the process of heat transfer to the nature of the simulated phenomena. (Simulation of the loss of superconductivity in a three-dimensional model of the metal-superconductor connection)
引用
收藏
页码：183 / 186
页数：4
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