Effect of mechanical milling on thermoelectric properties of half-Heusler ZrNiSn0.98Sb0.02 intermetallic compound

被引：24

作者：

Katsuyama, Shigeru ^{[1
]}

Kobayashi, Tetsuya ^{[1
]}

机构：

[1] Osaka Univ, Div Mat & Mfg Sci, Grad Sch Engn, Suita, Osaka 5650871, Japan

来源：

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2010年 / 166卷 / 01期

关键词：

Seebeck coefficient; Electrical resistivity; Thermal conductivity; Grain boundaries; Phonon dispersion; Figure of merit; STABILITY; PHASES; METAL;

D O I：

10.1016/j.mseb.2009.10.021

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermoelectric properties of half-Heusler ZrNiSn intermetallic compound were investigated. The partial substitution for Sn site in ZrNiSn by Sb is effective for the reduction of the electrical resistivity, which leads to increase the power factor of the compound. The thermal conductivity for ZrNiSn0.98Sb0.02 can be reduced by the mechanical milling process maintaining the moderate Seebeck coefficient and electrical resistivity. The reduction of the thermal conductivity is ascribed to the enhancement of the phonon scattering accompanied with the minute crystal grains in the milled compounds. As a result, ZrNiSn0.98Sb0.02 with a milling time of 3 h shows a maximum ZT of 0.67 at 573 K. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：99 / 103

页数：5

共 50 条

[31] Crucial Role of Ni Point Defects and Sb Doping for Tailoring the Thermoelectric Properties of ZrNiSn Half-Heusler Alloy: An Ab Initio Study
Ascrizzi, Eleonora
Ribaldone, Chiara
Casassa, Silvia
MATERIALS, 2024, 17 (05)
[32] High-temperature thermoelectric properties of Ti0.5(ZrHf)0.5-xNbxNi0.9Pd0.1Sn0.98Sb0.02 half-Heusler alloys
Lee, Ping-Jen
Chao, Long-Sun
JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 504 (01) : 192 - 196
[33] Thermoelectric and thermophysical properties of ErPdX (X=Sb and Bi) half-Heusler compounds
Sekimoto, Takeyuki
Kurosaki, Ken
Muta, Hiroaki
Yamanaka, Shinsuke
JOURNAL OF APPLIED PHYSICS, 2006, 99 (10)
[34] Thermoelectric and thermophysical properties of ErPdX (X=Sb and Bi) half-Heusler compounds
Sekimoto, Takeyuki
Kurosaki, Ken
Muta, Hiroaki
Yamanaka, Shinsuke
Journal of Applied Physics, 2006, 99 (10):
[35] Effects of partial substitution of Ni by Pd on the thermoelectric properties of ZrNiSn-based half-Heusler compounds
Shen, Q
Chen, L
Goto, T
Hirai, T
Yang, J
Meisner, GP
Uher, C
APPLIED PHYSICS LETTERS, 2001, 79 (25) : 4165 - 4167
[36] Creep behavior and postcreep thermoelectric performance of the n-type half-Heusler alloy Hf0.3Zr0.7NiSn0.98Sb0.02
Al Malki, M. M.
Qiu, Q.
Zhu, T.
Snyder, G. J.
Dunand, D. C.
MATERIALS TODAY PHYSICS, 2019, 9
[37] Mechanical and thermoelectric properties of FeVSb-based half-Heusler alloys
El-Khouly, A.
Adam, A. M.
Ibrahim, E. M. M.
Nafady, Ayman
Karpenkov, D.
Novitskii, A.
Voronin, A.
Khovaylo, V.
Elsehly, E. M.
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 886
[38] Thermoelectric Properties of Half-Heusler TiCoSb Synthesized by Mechanical Alloying Process
Ur, Soon-Chul
KOREAN JOURNAL OF MATERIALS RESEARCH, 2011, 21 (10): : 542 - 545
[39] Investigations of mechanical and thermoelectric properties of 'AlNiP' novel half-Heusler alloy
Gupta, Yuhit
Sinha, M. M.
Verma, S. S.
MATERIALS CHEMISTRY AND PHYSICS, 2021, 265
[40] Thermoelectric properties of the half-Heusler compound (Zr,Hf)(Ni,Pd)Sn
Browning, VM
Poon, SJ
Tritt, TM
Pope, AL
Bhattacharya, S
Volkov, P
Song, JG
Ponnambalam, V
Ehrlich, AC
THERMOELECTRIC MATERIALS 1998 - THE NEXT GENERATION MATERIALS FOR SMALL-SCALE REFRIGERATION AND POWER GENERATION APPLICATIONS, 1999, 545 : 403 - 412

← 1 2 3 4 5 →