Effect of mechanical milling on thermoelectric properties of half-Heusler ZrNiSn0.98Sb0.02 intermetallic compound

被引：24

作者：

Katsuyama, Shigeru ^{[1
]}

Kobayashi, Tetsuya ^{[1
]}

机构：

[1] Osaka Univ, Div Mat & Mfg Sci, Grad Sch Engn, Suita, Osaka 5650871, Japan

来源：

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2010年 / 166卷 / 01期

关键词：

Seebeck coefficient; Electrical resistivity; Thermal conductivity; Grain boundaries; Phonon dispersion; Figure of merit; STABILITY; PHASES; METAL;

D O I：

10.1016/j.mseb.2009.10.021

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thermoelectric properties of half-Heusler ZrNiSn intermetallic compound were investigated. The partial substitution for Sn site in ZrNiSn by Sb is effective for the reduction of the electrical resistivity, which leads to increase the power factor of the compound. The thermal conductivity for ZrNiSn0.98Sb0.02 can be reduced by the mechanical milling process maintaining the moderate Seebeck coefficient and electrical resistivity. The reduction of the thermal conductivity is ascribed to the enhancement of the phonon scattering accompanied with the minute crystal grains in the milled compounds. As a result, ZrNiSn0.98Sb0.02 with a milling time of 3 h shows a maximum ZT of 0.67 at 573 K. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：99 / 103

页数：5

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