CO2 laser cutting and ablative etching for the fabrication of paper-based devices

被引：76
|
作者：
Spicar-Mihalic, P. [1 ]
Toley, B. [1 ]
Houghtaling, J. [1 ]
Liang, T. [1 ]
Yager, P. [1 ]
Fu, E. [1 ]
机构：
[1] Univ Washington, Dept Bioengn, Seattle, WA 98195 USA
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2013年 / 23卷 / 06期
关键词：
NETWORK FORMAT;
D O I：
10.1088/0960-1317/23/6/067003
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing.
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页数：6
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