CO2 laser cutting and ablative etching for the fabrication of paper-based devices

被引：76

作者：

Spicar-Mihalic, P. ^{[1
]}

Toley, B. ^{[1
]}

Houghtaling, J. ^{[1
]}

Liang, T. ^{[1
]}

Yager, P. ^{[1
]}

Fu, E. ^{[1
]}

机构：

[1] Univ Washington, Dept Bioengn, Seattle, WA 98195 USA

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2013年 / 23卷 / 06期

关键词：

NETWORK FORMAT;

D O I：

10.1088/0960-1317/23/6/067003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We describe a method for fabricating paper-based microfluidic devices using a commercially available CO2 laser system. The method is versatile and allows for controlled through-cutting and ablative etching of nitrocellulose substrates. In addition, the laser system can cut a variety of components that are useful in the fabrication of paper-based devices, including cellulose wicking pads, glass fiber source pads and Mylar-based substrates for the device housing.

引用

页数：6

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