An improvement in reflow performance of plastic packages

被引：0
|
作者：
Cho, TJ
Lee, KJ
Lee, MH
Ahn, SH
Oh, SY
机构：
来源：
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ECTC.1996.550757
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：931 / 935
页数：3
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