An improvement in reflow performance of plastic packages

被引：0

|

作者：

Cho, TJ

Lee, KJ

Lee, MH

Ahn, SH

Oh, SY

机构：

来源：

46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS | 1996年

关键词：

D O I：

10.1109/ECTC.1996.550757

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：931 / 935

页数：3

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