Model and Measurement Technique for Temperature Dependent Electrothermal Parameters of Microbolometer Structures

被引:0
|
作者
Utermoehlen, Fabian [1 ]
Herrmann, Ingo [1 ]
机构
[1] Robert Bosch GmbH, Corp Sect Res & Adv Engn, Robert Bosch Pl 1, D-708396 Gerlingen, Germany
关键词
Microbolometer; temperature dependent thermal impedance; electrothermal modeling; thermal resistance; THERMAL-CONDUCTIVITY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A model and a measurement technique for the temperature dependent thermal impedance of microbolometer structures are presented. It is demonstrated that especially for automotive applications with an extended ambient temperature regime, a temperature impact on the thermal impedance has to be considered in electrothermal modeling. The modeling parameters can be determined with a demonstrated measurement technique which only relies on a single long pulse measurement and standard measurement equipment.
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页数:6
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