Model and Measurement Technique for Temperature Dependent Electrothermal Parameters of Microbolometer Structures

被引：0

作者：

Utermoehlen, Fabian ^{[1
]}

Herrmann, Ingo ^{[1
]}

机构：

[1] Robert Bosch GmbH, Corp Sect Res & Adv Engn, Robert Bosch Pl 1, D-708396 Gerlingen, Germany

来源：

2013 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP) | 2013年

关键词：

Microbolometer; temperature dependent thermal impedance; electrothermal modeling; thermal resistance; THERMAL-CONDUCTIVITY;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A model and a measurement technique for the temperature dependent thermal impedance of microbolometer structures are presented. It is demonstrated that especially for automotive applications with an extended ambient temperature regime, a temperature impact on the thermal impedance has to be considered in electrothermal modeling. The modeling parameters can be determined with a demonstrated measurement technique which only relies on a single long pulse measurement and standard measurement equipment.

引用

页数：6

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