Underfill process for two parallel plates and flip chip packaging

被引:12
|
作者
Khor, C. Y. [1 ]
Abdullah, M. Z. [1 ]
Ani, F. Che [2 ]
机构
[1] Univ Sains Malaysia, Sch Mech Engn, Nibong Tebal 14300, Penang, Malaysia
[2] Celestica M Sdn Bhd, Kulim, Kedah, Malaysia
关键词
Power law model; Non-Newtonian; Volume of fluid; Finite volume method; Computational fluid dynamic; NUMERICAL-SIMULATION; ENCAPSULATION PROCESS; FLOW CHARACTERISTICS; SOLDER BUMP; VISUALIZATION;
D O I
10.1016/j.icheatmasstransfer.2012.07.006
中图分类号
O414.1 [热力学];
学科分类号
摘要
Two parallel plates with a dimension of 5 mm x 5 mm and various gap heights (5, 10, 15, 20, 25,30, and 35 mu m) are simulated using a finite volume method-based software. A three-dimensional model is constructed, and a non-Newtonian underfill flow is simulated using computational fluid dynamics. The flow front advancement is monitored using the volume of fluid model. The underfill process for the two parallel plates and effect of gap height are the main focuses, and the application of flip chip packaging with a gap height of 30 mu m is studied. The gap height has a crucial influence on the filling time and pressure drop. The presence of solder bumps is found to have a significant effect on the flow pattern at the melt flow portion. The comparison of the simulation and analytical results are in good conformity for the underfill flow of the two parallel plates. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1205 / 1212
页数:8
相关论文
共 50 条
  • [1] A two-dimensional simulation model for the molded underfill process in flip chip packaging
    Guo, Xue-Ru
    Young, Wen-Bin
    [J]. JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, 2015, 29 (07) : 2967 - 2974
  • [2] A two-dimensional simulation model for the molded underfill process in flip chip packaging
    Xue-Ru Guo
    Wen-Bin Young
    [J]. Journal of Mechanical Science and Technology, 2015, 29 : 2967 - 2974
  • [3] Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
    Khor, C. Y.
    Abdullah, M. Z.
    Mujeebu, M. Abdul
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2012, 134 (01)
  • [4] Recent advances in modeling the underfill process in flip-chip packaging
    Wan, J. W.
    Zhang, W. J.
    Bergstrom, D. J.
    [J]. MICROELECTRONICS JOURNAL, 2007, 38 (01) : 67 - 75
  • [5] The underfIll processing technologies for flip chip packaging
    Chai, K
    Wu, L
    [J]. POLYTRONIC 2001, PROCEEDINGS, 2001, : 119 - 123
  • [6] Vacuum effect on the void formation of the molded underfill process in flip chip packaging
    Guo, Xue-Ru
    Young, Wen-Bin
    [J]. MICROELECTRONICS RELIABILITY, 2015, 55 (3-4) : 613 - 622
  • [7] Mechanism of underfill voids formation in flip chip packaging
    Goh, E
    Zhao, XL
    Anand, A
    Mui, YC
    [J]. PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 729 - 733
  • [8] Heat resistant underfill for flip-chip packaging
    Kim, W
    Bae, JW
    [J]. MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 2002, 374 : 409 - 414
  • [9] Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
    Lee, Seong Hyuk
    Lee, Hyung Jun
    Kim, Jong-Min
    Shin, Young Eui
    [J]. MATERIALS TRANSACTIONS, 2011, 52 (10) : 1998 - 2003
  • [10] Non-Newtonian Flow Formulation of the Underfill Process in Flip-Chip Packaging
    Young, Wen-Bin
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (12): : 2033 - 2037