Underfill process for two parallel plates and flip chip packaging

被引：12
|
作者：
Khor, C. Y. [1 ]
Abdullah, M. Z. [1 ]
Ani, F. Che [2 ]
机构：
[1] Univ Sains Malaysia, Sch Mech Engn, Nibong Tebal 14300, Penang, Malaysia
[2] Celestica M Sdn Bhd, Kulim, Kedah, Malaysia
来源：
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER | 2012年 / 39卷 / 08期
关键词：
Power law model; Non-Newtonian; Volume of fluid; Finite volume method; Computational fluid dynamic; NUMERICAL-SIMULATION; ENCAPSULATION PROCESS; FLOW CHARACTERISTICS; SOLDER BUMP; VISUALIZATION;
D O I：
10.1016/j.icheatmasstransfer.2012.07.006
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Two parallel plates with a dimension of 5 mm x 5 mm and various gap heights (5, 10, 15, 20, 25,30, and 35 mu m) are simulated using a finite volume method-based software. A three-dimensional model is constructed, and a non-Newtonian underfill flow is simulated using computational fluid dynamics. The flow front advancement is monitored using the volume of fluid model. The underfill process for the two parallel plates and effect of gap height are the main focuses, and the application of flip chip packaging with a gap height of 30 mu m is studied. The gap height has a crucial influence on the filling time and pressure drop. The presence of solder bumps is found to have a significant effect on the flow pattern at the melt flow portion. The comparison of the simulation and analytical results are in good conformity for the underfill flow of the two parallel plates. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1205 / 1212
页数：8
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