Heat resistant underfill for flip-chip packaging

被引：0
|
作者：
Kim, W [1 ]
Bae, JW [1 ]
机构：
[1] Pusan Natl Univ, Dept Chem Engn, Pusan 609735, South Korea
来源：
MOLECULAR CRYSTALS AND LIQUID CRYSTALS | 2002年 / 374卷
关键词：
underfill; flip-chip packaging; thermal reliability; DBMI;
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
DBMI-added underfill can show excellent thermal reliability, due to the superior properties. of CTE, the elastic modulus, and water resistance. When the properties of a DBMI (2wt%)-added underfill were compared with those of a typical underfill (epoxy/anhydride system), the value of CTE was reduced to less than one-half at the solder reflow temperature (about 200 degreesC), the elastic modulus was reduced to less than one-half in the temperature region below Tg, and water resistance improved by 2 times.
引用
收藏
页码：409 / 414
页数：6
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