共 50 条
- [31] Research on Thermal Analysis Method of 3D-stacked MRAM [J]. Tien Tzu Hsueh Pao/Acta Electronica Sinica, 2023, 51 (10): : 2775 - 2782
- [33] An Optimized 3D-Stacked Memory Architecture by Exploiting Excessive, High-Density TSV Bandwidth [J]. HPCA-16 2010: SIXTEENTH INTERNATIONAL SYMPOSIUM ON HIGH-PERFORMANCE COMPUTER ARCHITECTURE, PROCEEDINGS, 2010, : 429 - 440
- [34] Accelerating Sparse Matrix-Matrix Multiplication with 3D-Stacked Logic-in-Memory Hardware [J]. 2013 IEEE CONFERENCE ON HIGH PERFORMANCE EXTREME COMPUTING (HPEC), 2013,
- [35] A 3D-Stacked Logic-in-Memory Accelerator for Application-Specific Data Intensive Computing [J]. 2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
- [36] IMEC demonstrates feasibility of 3D-stacked IC integration [J]. ELECTRONICS WORLD, 2007, 113 (1855): : 4 - 4
- [37] Test and Debug Solutions for 3D-Stacked Integrated Circuits [J]. 2015 IEEE INTERNATIONAL TEST CONFERENCE (ITC), 2015,
- [39] Algorithm/Hardware Co-optimized SAR Image Reconstruction with 3D-stacked Logic in Memory [J]. 2014 IEEE HIGH PERFORMANCE EXTREME COMPUTING CONFERENCE (HPEC), 2014,
- [40] NDC: Analyzing the Impact of 3D-Stacked Memory plus Logic Devices on Map Reduce Workloads [J]. 2014 IEEE INTERNATIONAL SYMPOSIUM ON PERFORMANCE ANALYSIS OF SYSTEMS AND SOFTWARE (ISPASS), 2014, : 190 - 200