3D-Stacked Vertical Channel Nonvolatile Polymer Memory

被引:18
|
作者
Hwang, Sun Kak [1 ]
Cho, Suk Man [1 ]
Kim, Kang Lib [1 ]
Park, Cheolmin [1 ]
机构
[1] Yonsei Univ, Dept Mat Sci & Engn, Seoul 120749, South Korea
来源
ADVANCED ELECTRONIC MATERIALS | 2015年 / 1卷 / 1-2期
基金
新加坡国家研究基金会;
关键词
LOW-VOLTAGE; TRANSISTOR MEMORIES; SEMICONDUCTOR; NANOPARTICLES; FILMS;
D O I
10.1002/aelm.201400042
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A 3D-stacked one transistor memory with vertically defined submicrometer channels is realized by carefully designing device architecture involving repetitive deposition of layers in combination with a one-step bilayer transfer of a ferroelectric layer and a semiconducting one. The devices represent a milestone in the realization of mechanically flexible, one-transistor polymer memory with high memory performance.
引用
收藏
页数:7
相关论文
共 50 条
  • [1] MAC: Memory Access Coalescer for 3D-Stacked Memory
    Wang, Xi
    Tumeo, Antonino
    Leidel, John D.
    Li, Jie
    Chen, Yong
    [J]. PROCEEDINGS OF THE 48TH INTERNATIONAL CONFERENCE ON PARALLEL PROCESSING (ICPP 2019), 2019,
  • [2] Data Reorganization in Memory Using 3D-stacked DRAM
    Akin, Berkin
    Franchetti, Franz
    Hoe, James C.
    [J]. 2015 ACM/IEEE 42ND ANNUAL INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE (ISCA), 2015, : 131 - 143
  • [3] Smart Memory: Deep Learning Acceleration in 3D-Stacked Memories
    Rezaei, Seyyed Hossein SeyyedAghaei
    Moghaddam, Parham Zilouchian
    Modarressi, Mehdi
    [J]. IEEE COMPUTER ARCHITECTURE LETTERS, 2024, 23 (01) : 137 - 141
  • [4] Ultra-high bandwidth memory with 3D-stacked emerging memory cells
    Abe, Keiko
    Tendulkar, Mihir P.
    Jameson, John R.
    Griffin, Peter B.
    Nomura, Kumiko
    Fujita, Shinobu
    Nishi, Yoshio
    [J]. 2008 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, PROCEEDINGS, 2008, : 203 - +
  • [5] Thermal characteristics analysis and optimization of 3D-Stacked Memory Packaging
    Cao, Fengzhe
    Yang, Wen
    Yun, Minghui
    Yang, Daoguo
    [J]. 2022 19TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING & 2022 8TH INTERNATIONAL FORUM ON WIDE BANDGAP SEMICONDUCTORS, SSLCHINA: IFWS, 2022, : 121 - 124
  • [6] 3D-Stacked memory architectures for multi-core processors
    Loh, Gabriel H.
    [J]. ISCA 2008 PROCEEDINGS: 35TH INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE, 2008, : 453 - 464
  • [7] Heat Dissipation Capability of Package with Integrated Processor and 3D-Stacked Memory
    Han, Yong
    Che, F. X.
    Lim, Sharon Seow Huang
    Kawano, Masaya
    [J]. PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 813 - 817
  • [8] Yield Enhancement for 3D-Stacked Memory by Redundancy Sharing across Dies
    Jiang, Li
    Ye, Rong
    Xu, Qiang
    [J]. 2010 IEEE AND ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2010, : 230 - 234
  • [9] Accelerating Pointer Chasing in 3D-Stacked Memory: Challenges, Mechanisms, Evaluation
    Hsieh, Kevin
    Khan, Samira
    Vijaykumar, Nandita
    Chang, Kevin K.
    Boroumand, Amirali
    Ghose, Saugata
    Mutlu, Onur
    [J]. PROCEEDINGS OF THE 34TH IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN (ICCD), 2016, : 25 - 32
  • [10] Viscoelastic Simulation of Stress and Warpage for Memory Chip 3D-Stacked Package
    Wang, Xiyou
    Cao, Sicheng
    Lu, Guangsheng
    Yang, Daoguo
    [J]. COATINGS, 2022, 12 (12)