An Ultrasonic Knife System for MEMS Packaging

This paper proposes an ultrasonic knife system for MEMS packaging. The ultrasonic knife system is consisted of an ultrasonic transducer, a cutter and a gripper feeder. The ultrasonic transducer engenders high frequency vibration, which lead to the resonance of the structure. Amplitude transformer can magnify the amplitude. By the impact and collision of the cutter, the material can be cut through, and the high temperature created by high-frequency vibration can do the welding. The structure is designed and optimized by the finite element method, and a model machine is produced. According to the experimental results, the ultrasonic knife system has the virtues of high cutting force and better wedding feature, which are suitable for MEMS packaging.