Technology transfer: bridging the gap between universities and industry

被引：0

作者：

Chu, Benjamin ^{[1
]}

机构：

[1] UCLA, Technol Dev Grp, Los Angeles, CA 90024 USA

来源：

2017 IEEE 12TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS) | 2017年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

SS13.5

引用

页数：2

共 50 条

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