Technology transfer: bridging the gap between universities and industry

被引：0
|
作者：
Chu, Benjamin [1 ]
机构：
[1] UCLA, Technol Dev Grp, Los Angeles, CA 90024 USA
来源：
2017 IEEE 12TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
SS13.5
引用
收藏
页数：2
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