IGBT Junction Temperature Estimation in Water Cooling Power Modules

被引：0

作者：

Peng, Lisha ^{[1
,2
]}

Gao, Daqing ^{[1
]}

Shen, Wanzeng ^{[1
]}

Yan, Hongbin ^{[1
]}

机构：

[1] Chinese Acad Sci, Dept Power Supply, Inst Modern Phys, Lanzhou, Gansu, Peoples R China

[2] Univ Chinese Acad Sci, Fac Phys, Beijing, Peoples R China

来源：

2018 IEEE INTERNATIONAL POWER ELECTRONICS AND APPLICATION CONFERENCE AND EXPOSITION (PEAC) | 2018年

关键词：

IGBT electro-thermal model; chip temperature; water cooling efficiency; thermal reliability;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Power semiconductor device IGBT is related to the reliability of the power module, so it is necessary to obtain accurate IGBT junction temperature. In this paper, an electrothermal model of IGBT is established based on the theory of electrothermal analogy. The methods of interpolation, curve fitting and cyclic iteration are used to build the model, so junction temperature of IGBT module under different input conditions can be obtained. We also use the model to evaluate the efficiency of water cooling. The model can not only estimate the junction temperature accurately, but also assist the heat sink design, which helps to improve the reliability of the power module and has strong versatility.

引用

页码：1065 / 1070

页数：6

共 50 条

[41] Combination of Two Variables in a Junction Temperature Control System to Elongate the Expected Lifetime of IGBT-Power-Modules
Woelfle, Julian
Nitzsche, Maximillian
Troester, Nathan
Ruthardt, Johannes
Stempfle, Martin
Roth-Stielow, Joerg
2017 IEEE 12TH INTERNATIONAL CONFERENCE ON POWER ELECTRONICS AND DRIVE SYSTEMS (PEDS), 2017, : 41 - 47
[42] The Influence of PVTf on Machine Learning Estimation of IGBT Junction Temperature
Ribeiro, Andrei
Carvalho, Romullo
da Silva, Paulo
Lima, Geyciane
Prym, Guilherme
Barros, Tarcio
Marques, Francisco
Villalva, Marcelo
ADVANCES IN CONTROL POWER SYSTEMS AND EMERGING TECHNOLOGIES, VOL 2, ICESA 2023, 2024, : 107 - 116
[43] Application of IGBT junction temperature estimation in hybrid electric vehicles
Ma, Tianyu
Yan, Bowen
Liu, Bin
Liu, Jun
MICROELECTRONICS RELIABILITY, 2025, 167
[44] IGBT Junction Temperature Estimation Based on Machine Learning Method
Miao, JiGui
Yin, Quan
Wang, Hao
Liu, Yang
Li, Haichun
Duan, Sanding
2020 IEEE 9TH INTERNATIONAL POWER ELECTRONICS AND MOTION CONTROL CONFERENCE (IPEMC2020-ECCE ASIA), 2020,
[45] Lifetime estimation for IGBT modules in power converter under power fluctuation condition
School of Reliability and Systems Engineering, Beihang University, Beijing, China
Saf. Reliab. – Theory Appl. - Proc. Eur. Saf. Reliab. Conf., (3223-3230):
[46] A Comparison of Chip Temperature Acquisition Technologies of IGBT Power Modules
Chen, Shiying
Vilchis-Rodriguez, Damian
Barnes, Mike
Djurovic, Sinisa
IEEE SENSORS JOURNAL, 2024, 24 (12) : 19107 - 19116
[47] Impact of Bond Wire Degradation on Thermal Estimation and Temperature Coefficient of IGBT Modules in Power Cycling Test
Zhang, Yichi
Zhang, Yi
Yao, Bo
Wang, Huai
2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, 2024, : 2443 - 2447
[48] Vce-based chip temperature estimation methods for high power IGBT modules during power cycling - A comparison
Amoiridis, Anastasios
Anurag, Anup
Ghimire, Pramod
Munk-Nielsen, Stig
Baker, Nick
2015 17TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'15 ECCE-EUROPE), 2015,
[49] Junction temperature management of IGBT module in power electronic converters
Zhou, Luowei
Wu, Junke
Sun, Pengju
Du, Xiong
MICROELECTRONICS RELIABILITY, 2014, 54 (12) : 2788 - 2795
[50] Junction Temperature Estimation via Plug-in System for the Design Validation of IGBT Industrial Power Converters
Gregorio, Matteo
Stella, Fausto
Bojoi, Radu
Pagani, Fabio
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2022, 58 (05) : 6310 - 6321

← 1 2 3 4 5 →