MOS C-V characterization of ultrathin gate oxide thickness (1.3-1.8 nm)

被引:60
|
作者
Choi, CH [1 ]
Goo, JS
Oh, TY
Yu, ZP
Dutton, RW
Bayoumi, A
Cao, M
Vande Voorde, P
Vook, D
Diaz, CH
机构
[1] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94305 USA
[2] HP Co, HP Lab, ULSI Lab, Palo Alto, CA 94303 USA
[3] Taiwan Semicond Mfg Co, Hsinchu, Taiwan
基金
美国国家科学基金会;
关键词
device simulation; MOS C-V modeling; quantum mechanical corrections; SPICE; ultrathin gate oxide;
D O I
10.1109/55.767102
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An equivalent circuit approach to MOS capacitance-voltage (C-V) modeling of ultrathin gate oxides (1.3-1.8 nm) is proposed, Capacitance simulation including polysilicon depletion is based on quantum mechanical (QM) corrections implemented in a two-dimensional (2-D) device simulator; tunneling current is calculated using a one-dimensional (1-D) Green's function solver, The sharp decrease in capacitance observed for gate oxides below 2.0 nm in both accumulation and inversion is modeled using distributed voltage-controlled RC networks. The imaginary components of small-signal input admittance obtained from AC network analysis agree well with measured capacitance.
引用
收藏
页码:292 / 294
页数:3
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