Three Dimensional Dynamic Random Access Memory

被引：0
|
作者：
Kirihata, Toshiaki [1 ]
机构：
[1] IBM Syst & Technol Grp, Semicond Res & Dev Ctr, Hopewell Jct, NY 12533 USA
来源：
2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2014年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We review high-density embedded 3D DRAM cache, industry 3D stacked DDR3 and wide IO mobile DRAM along with more recent Hybrid-Memory Cube (HMC) and High-Bandwidth Memory (HBM).
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页码：2 / 2
页数：1
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