Preparation of high-quality AlN on sapphire by high-temperature face-to-face annealing

被引:245
|
作者
Miyake, Hideto [1 ,2 ]
Lin, Chia-Hung [2 ]
Tokoro, Kenta [2 ]
Hiramatsu, Kazumasa [2 ]
机构
[1] Mie Univ, Grad Sch Reg Innovat Studies, Tsu, Mie 5148507, Japan
[2] Mie Univ, Dept Elect & Elect Engn, Tsu, Mie 5148507, Japan
关键词
Crystal morphology; Recrystallization; Physical vapor deposition processes; Solid phase epitaxy; Nitrides; Semiconducting aluminum compounds; NITRIDE; GROWTH; ALGAN; GAN;
D O I
10.1016/j.jcrysgro.2016.08.028
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
The annealing of sputtered AlN films with different thicknesses grown on sapphire in nitrogen ambient was investigated. In the annealing, two AlN films on sapphire were overlapped "face-to-face" to suppress the thermal decomposition of the AlN films. The sputtered AlN films with small grains consisted of columnar structure were initially aligned with (0002) orientation but became slightly inclined with increasing film thickness resulting in the formation of a two-layer structure. After annealing, films became a single crystalline layer regardless of the film thickness, and their crystallinity markedly improved after annealing at 1600-1700 degrees C. The full widths at half maximum of the (0002)- and (1012)-plane X-ray rocking curves were improved to 49 and 287 arcsec, respectively, owing to the annihilation of domain boundaries in the sputtered AlN films, which concurrently increased the compressive stress in the films. (C) 2016 The Authors. Published by Elsevier B.V.
引用
收藏
页码:155 / 159
页数:5
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