Skin and proximity effects of curved microstrip interconnects

An accurate procedure was proposed to capture the skin and proximity effects of microstrip interconnects on curved surfaces using an extended volume filament model. These conformal geometries can incorporate some special applications where cylindrical or even elliptic substrate must be used. Parasitic studies were performed to show the hybrid effects of all geometrical and physical parameters on the frequency-dependent distributed series resistance and inductance of these interconnects, which can be further used to predict their responses in the presence of high-power or ultra-wideband electromagnetic pulses.