Skin and proximity effects of curved microstrip interconnects

被引：0
|
作者：
Hua, Qi [1 ]
Mao, Junfa [1 ]
Yin, Wen-Yan [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Elect Informat & Elect Engn, Shanghai 200030, Peoples R China
来源：
2005 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS, VOLS 1-5 | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An accurate procedure was proposed to capture the skin and proximity effects of microstrip interconnects on curved surfaces using an extended volume filament model. These conformal geometries can incorporate some special applications where cylindrical or even elliptic substrate must be used. Parasitic studies were performed to show the hybrid effects of all geometrical and physical parameters on the frequency-dependent distributed series resistance and inductance of these interconnects, which can be further used to predict their responses in the presence of high-power or ultra-wideband electromagnetic pulses.
引用
收藏
页码：1291 / 1294
页数：4
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