Efficienct Toothed Microstrip Interconnects

被引:0
|
作者
Khalaj-Amirhosseini, M. [1 ]
Moeeni-Fard, M. [1 ]
机构
[1] College of Electrical Engineering, Iran University of Science and Technology, Tehran, Iran
关键词
D O I
6999765
中图分类号
学科分类号
摘要
9
引用
收藏
页码:1469 / 1470
相关论文
共 50 条
  • [1] Efficienct Toothed Microstrip Interconnects
    Khalaj-Amirhosseini, M.
    Moeeni-Fard, M.
    2014 22ND IRANIAN CONFERENCE ON ELECTRICAL ENGINEERING (ICEE), 2014, : 1469 - 1470
  • [2] Efficient nonuniform microstrip interconnects
    Khalaj-Amirhosseini, M
    JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS, 2005, 19 (11) : 1455 - 1465
  • [3] Analysis of densely packed microstrip interconnects
    Lin, CM
    Chan, CH
    1997 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS, VOLS I-III, 1997, : 841 - 844
  • [4] Optimum design of microstrip RF interconnects
    Amirhosseini, MK
    Cheldavi, A
    JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS, 2004, 18 (12) : 1707 - 1715
  • [5] SPURIOUS RADIATION FROM MICROSTRIP INTERCONNECTS
    AKSUN, MI
    MITTRA, R
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1993, 35 (02) : 148 - 158
  • [6] Characterization of microstrip meanders in PCB interconnects
    Orhanovic, N
    Raghuram, R
    Matsui, N
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 508 - 512
  • [7] A Broadband Microstrip-to-Microstrip Transition for Flip-Chip Interconnects
    Qiu, Zelong
    Deng, Tianwei
    2021 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2021, : 382 - 384
  • [8] Microstrip equivalent parasitics modeling of RFIC interconnects
    Mukherjee, Jayanta
    Kim, Young-Gi
    Suh, Inwon
    Roblin, Patrick
    Lin, Yao-Chian
    Liou, Wan Rone
    Baghini, M. Shojaei
    2007 50TH MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-3, 2007, : 376 - +
  • [9] Skin and proximity effects of curved microstrip interconnects
    Hua, Qi
    Mao, Junfa
    Yin, Wen-Yan
    2005 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS, VOLS 1-5, 2005, : 1291 - 1294
  • [10] Design of Microstrip-to-Microstrip Transition for HighDensity Flip-Chip Interconnects
    Yan, Qiaolin
    Wu, Xuan
    Deng, Tianwei
    2022 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS, IMWS-AMP, 2022,