Electrothermal Modelling of Novel Through-Silicon Carbon Nanotube Bundle Vias (TS-CNTBV)

被引：0
|
作者：
Liu, Yun-Fan [1 ]
Yong, Zheng [1 ]
Jiao, Yan-Song [1 ]
Zhao, Wen-Sheng [1 ]
Yin, Wen-Yan [1 ]
机构：
[1] Zhejiang Univ, State Key Lab Modern Opt Instrument, Ctr Opt & Electromagnet Res, Zhejiang Prov Key Lab Sensing Technol, Hangzhou 310058, Zhejiang, Peoples R China
来源：
2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2012年
关键词：
PERFORMANCE ANALYSIS; INTERCONNECTS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, we at first propose an almost-carbon interconnects structure consisting of through-silicon carbon nanotube bundle vias (TS-CNTBV), graphene-based transmission lines (GTL) and metal bumps. In order to characterize its electrical performance, an effective complex conductivity of the CNT bundle is introduced and studied for different temperatures and CNT radii. Further, the TS-CNTBV transmission characteristics are investigated based on its distributed transmission line model, and in particular, effects of metallic bump attached to the TS-CNTBV are considered and treated in an appropriate way.
引用
收藏
页码：53 / 56
页数：4
相关论文
共 47 条
  • [41] Growth and Fabrication of Carbon-Based Three-Dimensional Heterostructure in Through-Silicon Vias (TSVs) for 3D Interconnects
    Zhu, Ye
    Tan, Chong Wei
    Chua, Shen Lin
    Lim, Yu Dian
    Tay, Beng Kang
    Tan, Chuan Seng
    [J]. 2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017,
  • [42] Thermo-Mechanical Characterization of Single-Walled Carbon Nanotube (SWCNT)-Based Through-Silicon via (TSV) in (100) Silicon
    Yin, Xiangkun
    Zhu, Zhangming
    Yang, Yintang
    Ding, Ruixue
    [J]. NANOSCIENCE AND NANOTECHNOLOGY LETTERS, 2015, 7 (06) : 481 - 485
  • [43] The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology
    Yen, C-M
    Chang, S-Y
    Chen, K-C
    Feng, Y-J
    Chen, L-H
    Liao, B-Z
    Lee, M-H
    Chen, S-C
    Liao, M-H
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (03) : 1600 - 1603
  • [44] A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias
    Park, Junyong
    Jung, Daniel H.
    Kim, Byunggon
    Choi, Sumin
    Kim, Youngwoo
    Park, Shinyoung
    Park, Gapyeol
    Cho, Kyungjun
    Lee, Seongsoo
    Kim, Joungho
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2019, 61 (04) : 1198 - 1206
  • [45] On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits
    Hu, Qing-Hao
    Zhao, Wen-Sheng
    Fu, Kai
    Wang, Da-Wei
    Wang, Gaofeng
    [J]. IET CIRCUITS DEVICES & SYSTEMS, 2021, 15 (01) : 20 - 26
  • [46] Multi-Layer Chips on Wafer Stacking Technologies with Carbon Nano-Tubes as Through-Silicon Vias and it's potential applications for Power-Via technologies
    Liao, Bo-Zhou
    Chen, Liang-Hsi
    Chen, Kai-Cheng
    Lin, Hong-Yi
    Tsai, Yi-Ting
    Chen, Ting-Wei
    Chan, Yi-Cheng
    Lee, Min-Hung
    Liao, Ming-Han
    [J]. IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1811 - 1817
  • [47] Mechanical integrity of a carbon nanotube/copper- based through-silicon via for 3D integrated circuits: a multi-scale modeling approach
    Awad, Ibrahim
    Ladani, Leila
    [J]. NANOTECHNOLOGY, 2015, 26 (48)
12345