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- [3] Optical through-wafer interconnects for 3D hyper-integration [J]. 2006 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2006, : 28 - +
- [4] Through-wafer interconnection by deep damascene process for MEMS and 3D wafer level packaging [J]. PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 238 - 242
- [5] Implementation of SOG devices with embedded through-wafer silicon vias using a glass reflow process for wafer-level 3D MEMS integration [J]. MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2008, : 802 - +
- [6] SILICON-EMBEDDED 3D TOROIDAL AIR-CORE INDUCTOR WITH THROUGH-WAFER INTERCONNECT FOR ON-CHIP INTEGRATION [J]. 2012 IEEE 25TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2012,
- [9] High aspect ratio through-wafer interconnections for 3D-microsystems [J]. MEMS-03: IEEE THE SIXTEENTH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, 2003, : 634 - 637
- [10] 3D THROUGH-SILICON VIA FILLING WITH ELECTROCHEMICAL NANOMATERIALS [J]. PHYSICS, CHEMISTRY AND APPLICATIONS OF NANOSTRUCTURES: REVIEWS AND SHORT NOTES, 2013, : 331 - 339