Challenges of flip chip an organic substrate assembly technology

被引：0

作者：

Nagesh, VK ^{[1
]}

Peddada, R ^{[1
]}

Ramalingam, S ^{[1
]}

Sur, B ^{[1
]}

Tai, A ^{[1
]}

机构：

[1] Intel Corp, Assembly Technol Dev, Santa Clara, CA 95052 USA

来源：

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS | 1999年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel's microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed. The paper discusses the challenges faced, and their resolution during the development of this key technology that is implemented in high volume manufacturing at Intel.

引用

页码：975 / 978

页数：4

共 50 条

[31] Flip chip: A technology reborn
Christensen, M
SOLID STATE TECHNOLOGY, 1999, 42 (06) : 38 - +
[32] Aspects of Applying Flip-Chip Technology for SiC Power Devices Assembly
Mysliwiec, Marcin
Guziewicz, Marek
Kisiel, Ryszard
2013 PROCEEDINGS OF THE 36TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2013, : 90 - 93
[33] Development of fine pitch solder joint interconnection technology for flip chip assembly
Wei, Z
Poo, CY
Waf, LS
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 509 - 514
[34] Flip-chip BGA applied high-density organic substrate
Baba, S
Wu, Q
Hayashi, E
Watanabe, M
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 243 - 249
[35] Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle
Wang, JL
MICROELECTRONICS RELIABILITY, 2002, 42 (02) : 293 - 299
[36] Flip-chip BGA applied high-density organic substrate
Baba, Shinji
Wu, Qiang
Hayashi, Eiji
Watanabe, Masaki
Matsushima, Hironori
Tomita, Yoshihiro
Takemoto, Yoshitaka
Proceedings - Electronic Components and Technology Conference, 1999, : 243 - 249
[37] Flip chip pad structure for high density organic build up substrate
Nakamura, K
Harazono, M
Yamashita, H
Ding, DH
Baker, J
Dubey, A
PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 283 - 285
[38] Underfill of flip chip on organic substrate: Viscosity, surface tension, and contact angle
Intel Corporation, 5000 Chandler Boulevard, Chandler, AZ 85226, United States
Microelectron. Reliab., 2 (293-299):
[39] Electrical performance of an organic, z-interconnect, flip-chip substrate
Rowlands, Michael J.
Das, Rabindra
57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 346 - +
[40] Flip chip on organic substrates
Borgesen, P
SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 121 - 127

← 1 2 3 4 5 →