Underfill of flip chip on organic substrate: Viscosity, surface tension, and contact angle

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作者：
Intel Corporation, 5000 Chandler Boulevard, Chandler, AZ 85226, United States [1 ]
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来源：
Microelectron. Reliab. | / 2卷 / 293-299期
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Compendex;
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摘要：
Chip scale packages - Contact angle - Curing - Epoxy resins - Fillers - Rheology - Soldered joints - Substrates - Surface tension - Thermal effects - Viscosity - Wetting
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