Characterization of planar and 3D Silicon pixel sensors for the high luminosity phase of the CMS experiment at LHC

被引:0
|
作者
Ceccarelli, R. [1 ,2 ]
Meschini, M. [1 ]
Viliani, L. [1 ]
Dinardo, M. [3 ,4 ]
Gennai, S. [3 ]
Menasce, D. [3 ]
Moroni, L. [3 ,4 ]
Zuolo, D. [3 ,4 ]
Demaria, L. [5 ]
Monteil, E. [5 ]
Gaioni, L. [6 ,7 ]
Messineo, A. [8 ,9 ]
Curras, E. [10 ]
Duarte, J. [10 ]
Fernandez, M. [10 ]
Gomez, G. [10 ]
Garcia, A. [10 ]
Gonzalez, J. [10 ]
Silva, E. [10 ]
Vila, I. [10 ]
Dalla Betta, G. F. [11 ]
Mendicino, R. [8 ,11 ]
Boscardin, M. [12 ]
机构
[1] INFN Firenze, Florence, Italy
[2] Univ Firenze, Florence, Italy
[3] INFN Milano Bicocca, Milan, Italy
[4] Univ Milano Bicocca, Milan, Italy
[5] INFN Torino, Turin, Italy
[6] INFN Pavia, Pavia, Italy
[7] Univ Bergamo, Bergamo, Italy
[8] INFN, Rome, Italy
[9] Univ Pisa, Pisa, Italy
[10] IFCA, Santander, Spain
[11] Univ Trento, Trento, Italy
[12] FBK Fdn Bruno Kessler, Trento, Italy
基金
欧盟地平线“2020”;
关键词
D O I
暂无
中图分类号
O412 [相对论、场论]; O572.2 [粒子物理学];
学科分类号
摘要
The High Luminosity upgrade of the CERN LHC collider (HL-LHC) demands for a new, highradiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10(16) n(eq)/cm(2) at similar to 3cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler (FBK), is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si DirectWafer Bonding technique, which allows for the production of sensors with 100 mu m and 130 mu m active thickness for planar sensors, and 130 m m for 3D sensors, the thinnest ones ever produced so far. Prototypes of hybrid modules, bumpbonded to the RD53A readout chip, have been tested on beam. First results on their performance before and after irradiation are presented.
引用
收藏
页数:6
相关论文
共 50 条
  • [31] Development of a Level 1 Track Trigger for the CMS experiment at the high-luminosity LHC
    Pozzobon, Nicola
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2013, 732 : 151 - 155
  • [32] Performance of CMS 3D silicon pixel detectors before and after irradiation
    Obertino, M.
    Solano, A.
    Alagoz, E.
    Andresen, J.
    Arndt, K.
    Bolla, G.
    Bortoletto, D.
    Boscardin, M.
    Brosius, R.
    Bubna, M.
    Dalla Betta, G. -F.
    Jensen, F.
    Krzywda, A.
    Kumar, A.
    Kwan, S.
    Lei, C. M.
    Menasce, D.
    Moroni, L.
    Ngadiuba, J.
    Osipenkov, I.
    Perera, L.
    Povoli, M.
    Prosser, A.
    Rivera, R.
    Shipsey, I.
    Tan, P.
    Terzo, S.
    Uplegger, L.
    Wagner, S.
    Pereira, A. Vilela
    Dinardo, M.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2013, 730 : 33 - 37
  • [33] Beam Test Measurements on Planar Pixel Sensors for the CMS Phase 2 Upgrade
    Feindt, Finn
    2019 IEEE NUCLEAR SCIENCE SYMPOSIUM AND MEDICAL IMAGING CONFERENCE (NSS/MIC), 2019,
  • [34] Simulation and laboratory test results of 3D CMS pixel detectors for HL-LHC
    Alagoz, E.
    Bubna, M.
    Krzywda, A.
    Dalla Betta, G. F.
    Povoli, M.
    Obertino, M. M.
    Solano, A.
    Vilela Pereirah, A.
    Arndt, K.
    Bolla, G.
    Bortoletto, D.
    Boscardin, M.
    Kwan, S.
    Rivera, R.
    Shipsey, I.
    Uplegger, L.
    JOURNAL OF INSTRUMENTATION, 2012, 7
  • [35] OMEGAPIX2: 3D integrated circuit prototype dedicated to the ATLAS pixel detector for the High Luminosity LHC
    Genat, J-F.
    Le Dortz, O.
    Lounis, A.
    Martin-Chassard, G.
    Tongbong, J.
    Thienpont, D.
    2012 IEEE NUCLEAR SCIENCE SYMPOSIUM AND MEDICAL IMAGING CONFERENCE RECORD (NSS/MIC), 2012, : 793 - 796
  • [36] Test beam characterization of irradiated 3D pixel sensors
    Garcia Alonso, A.
    Curras, E.
    Duarte-Campderros, J.
    Fernandez, M.
    Gomez, G.
    Gonzalez, J.
    Silva, E.
    Vila, I
    Jaramillo, R.
    Meschini, M.
    Ceccarelli, R.
    Dinardo, M.
    Gennai, S.
    Moroni, L.
    Zuolo, D.
    Demaria, N.
    Monteil, E.
    Gaioni, L.
    Messineo, A.
    Dalla Beta, G-F
    Menicino, R.
    Boscardin, M.
    Hidalgo, S.
    Merlos, A.
    Pellegrini, G.
    Quirion, D.
    Manna, M.
    JOURNAL OF INSTRUMENTATION, 2020, 15 (03):
  • [37] Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade
    W. Adam
    T. Bergauer
    E. Brondolin
    M. Dragicevic
    M. Friedl
    R. Frühwirth
    M. Hoch
    J. Hrubec
    A. König
    H. Steininger
    W. Waltenberger
    S. Alderweireldt
    W. Beaumont
    X. Janssen
    J. Lauwers
    P. Van Mechelen
    N. Van Remortel
    A. Van Spilbeeck
    D. Beghin
    H. Brun
    B. Clerbaux
    H. Delannoy
    G. De Lentdecker
    G. Fasanella
    L. Favart
    R. Goldouzian
    A. Grebenyuk
    G. Karapostoli
    Th. Lenzi
    A. Léonard
    J. Luetic
    N. Postiau
    T. Seva
    P. Vanlaer
    D. Vannerom
    Q. Wang
    F. Zhang
    S. Abu Zeid
    F. Blekman
    I. De Bruyn
    J. De Clercq
    J. D’Hondt
    K. Deroover
    S. Lowette
    S. Moortgat
    L. Moreels
    Q. Python
    K. Skovpen
    P. Van Mulders
    I. Van Parijs
    The European Physical Journal C, 2017, 77
  • [38] 3D silicon pixel sensors: Recent test beam results
    Hansson, P.
    Balbuena, J.
    Barrera, C.
    Bolle, E.
    Borri, M.
    Boscardin, M.
    Chmeissan, M.
    Dalla Betta, G. -F.
    Darbo, G.
    Da Via, C.
    Devetak, E.
    DeWilde, B.
    Su, D.
    Dorholt, O.
    Fazio, S.
    Fleta, C.
    Gemme, C.
    Giordani, M.
    Gjersdal, H.
    Grenier, P.
    Grinstein, S.
    Hasi, J.
    Helle, K.
    Huegging, F.
    Jackson, P.
    Kenney, C.
    Kocian, M.
    Korolkov, I.
    La Rosa, A.
    Mastroberardino, A.
    Micelli, A.
    Nellist, C.
    Nordahl, P.
    Rivero, F.
    Rohne, O.
    Sandaker, H.
    Silverstein, D.
    Sjoebaek, K.
    Slaviec, T.
    Stupak, J.
    Troyano, I.
    Tsung, J.
    Tsybychev, D.
    Wermes, N.
    Young, C.
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2011, 628 (01): : 216 - 220
  • [39] Characterisation of irradiated thin silicon sensors for the CMS phase II pixel upgrade
    Adam, W.
    Bergauer, T.
    Brondolin, E.
    Dragicevic, M.
    Friedl, M.
    Fruehwirth, R.
    Hoch, M.
    Hrubec, J.
    Koenig, A.
    Steininger, H.
    Waltenberger, W.
    Alderweireldt, S.
    Beaumont, W.
    Janssen, X.
    Lauwers, J.
    Van Mechelen, P.
    Van Remortel, N.
    Van Spilbeeck, A.
    Beghin, D.
    Brun, H.
    Clerbaux, B.
    Delannoy, H.
    De Lentdecker, G.
    Fasanella, G.
    Favart, L.
    Goldouzian, R.
    Grebenyuk, A.
    Karapostoli, G.
    Lenzi, Th.
    Leonard, A.
    Luetic, J.
    Postiau, N.
    Seva, T.
    Vanlaer, P.
    Vannerom, D.
    Wang, Q.
    Zhang, F.
    Abu Zeid, S.
    Blekman, F.
    De Bruyn, I.
    De Clercq, J.
    D'Hondt, J.
    Deroover, K.
    Lowette, S.
    Moortgat, S.
    Moreels, L.
    Python, Q.
    Skovpen, K.
    Van Mulders, P.
    Van Parijs, I.
    EUROPEAN PHYSICAL JOURNAL C, 2017, 77 (08):
  • [40] RPC radiation background simulations for the high luminosity phase in the CMS experiment
    Uribe Estrada, C.
    Carpinteyro Bernardino, S.
    Castaneda Hernandez, A.
    Fagot, A.
    Gul, M.
    Roskas, C.
    Tytgat, M.
    Zaganidis, N.
    Fonseca De Souza, S.
    Santoro, A.
    Da Silva De Araujo, F. Torres
    Aleksandrov, A.
    Hadjiiska, R.
    Iaydjiev, P.
    Rodozov, M.
    Shopova, M.
    Sultanov, G.
    Dimitrov, A.
    Litov, L.
    Pavlov, B.
    Petkov, P.
    Petrov, A.
    Qian, S. J.
    Han, D.
    Yi, W.
    Avila, C.
    Cabrera, A.
    Carrillo, C.
    Segura, M.
    Aly, S.
    Assran, Y.
    Mahrous, A.
    Mohamed, A.
    Combaret, C.
    Gouzevitch, M.
    Grenier, G.
    Lagarde, F.
    Laktineh, I. B.
    Mathez, H.
    Mirabito, L.
    Shchablo, K.
    Bagaturia, I.
    Lomidze, D.
    Lomidze, I.
    Pant, L. M.
    Bhatnagar, V.
    Gupta, R.
    Kumari, R.
    Lohan, M.
    Singh, J. B.
    JOURNAL OF INSTRUMENTATION, 2019, 14 (09):