The Compressive Behavior of Porous AlSi10Mg Prepared by Selective Laser Melting (SLM)

AlSi10Mg porous alloy was prepared by selective laser melting (SLM) with a Nd:YAG laser beam, and the compression properties were studied using both experiments and the finite element method (FEM). The results illustrate that the porous alloy undergoes elastic deformation, plastic deformation and densification stage. The joints of the porous alloy are preferentially fractured, and the Si content at the bottom position of the dimple is higher than the dimple edge. During the compression process of the porous AlSi10Mg alloy, the stress and strain distribution at the joint are concentrated, resulting in joint fracture. The inherent elasticity, shear stress and forced contact of supporting plates or chips are the causes of these compression stages. The distribution of Si element in the fracture is caused by the dimples that are easily formed at the alpha-Al/Si interface, eventually resulting in the Si content at the bottom of the dimple being higher than the dimple edge.