hot embossing;
poly (methyl methacrylate);
average molecular weight;
number average molecular weight;
MICROLENS ARRAYS;
LITHOGRAPHY;
FABRICATION;
D O I:
10.4028/www.scientific.net/AMR.683.133
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
Hot-embossing experiments were conducted on poly (methyl methacrylate) orthogonal arrays with base widths of 1 mu m, 3 mu m, 5 mu m, 10 mu m, and 50 mu m. The relationship between the base width with respect to average molecular weight and number average molecular weight of micropattern were also investigated. It was discovered that the average molecular weight and number average molecular weight decreased as the base width increased.
机构:
Osaka City Univ, Grad Sch, Dept Mech & Phys Engn, Sumiyoshi Ku, Osaka 5588585, JapanOsaka City Univ, Grad Sch, Dept Mech & Phys Engn, Sumiyoshi Ku, Osaka 5588585, Japan
Hara, Yoshiaki
Hiruma, Shigeo
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机构:
Osaka City Univ, Grad Sch, Dept Mech & Phys Engn, Sumiyoshi Ku, Osaka 5588585, JapanOsaka City Univ, Grad Sch, Dept Mech & Phys Engn, Sumiyoshi Ku, Osaka 5588585, Japan
Hiruma, Shigeo
Nanzai, Yakuo
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h-index: 0
机构:
Osaka City Univ, Grad Sch, Dept Mech & Phys Engn, Sumiyoshi Ku, Osaka 5588585, JapanOsaka City Univ, Grad Sch, Dept Mech & Phys Engn, Sumiyoshi Ku, Osaka 5588585, Japan
机构:Natl Technical Univ of Athens, Lab, of Special Chemical Technology,, Athens, Greece, Natl Technical Univ of Athens, Lab of Special Chemical Technology, Athens, Greece