Low-power nanophotonics: Material and device technology

被引:0
|
作者
Thylen, Lars [1 ]
Holmstrom, Petter [1 ]
Wosinski, Lech [1 ]
Lourdudoss, Sebastian
机构
[1] Royal Inst Technol KTH, Lab Photon & Microwave Engn, SE-16440 Kista, Sweden
来源
INTEGRATED OPTICS: PHYSICS AND SIMULATIONS | 2013年 / 8781卷
关键词
Nanophotonics; low-power photonics; optical switch; electro-optic polymer; plasmonics; Forster coupling; silicon photonics; III-V heteroepitaxy on silicon; PLASMONIC WAVE-GUIDE; INTEGRATED-CIRCUITS;
D O I
10.1117/12.2018893
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Development in photonics for communications and interconnects pose increasing requirements on reduction of footprint, power dissipation and cost, as well as increased bandwidth. Nanophotonics integrated photonics has been viewed as a solution to this, capitalizing on development in nanotechnology and an increased understanding of light matter interaction on the nanoscale. The latter can be exemplified by plasmonics and low dimensional semiconductors such as quantum dots (QDs). In this scenario the development of improved electrooptic materials is of great importance, the electrooptic polymers being an example, since they potentially offer superior properties for optical phase modulators in terms of power and integratability. Phase modulators are essential for e. g. the rapidly developing advanced modulation formats, since phase modulation basically can generate any type of modulation. The electrooptic polymers, in combination with plasmonics nanoparticle array waveguides or nanostructured hybrid plasmonic media can give extremely compact and low power dissipation modulators. Low-dimensional semiconductors, e. g. in the shape of QDs, can be employed for modulation or switching functions, offering possibilities for scaling to 2 or 3 dimensions for advanced switching functions. In both the high field confinement plasmonics and QDs, the nanosizing is due to near-field interactions, albeit being of different physical origin in the two cases. Epitaxial integration of III-V structures on Si plays an important role in developing high-performance light sources on silicon, eventually integrated with silicon electronics. A brief remark on all-optical vs. electronically controlled optical switching systems is also given.
引用
收藏
页数:9
相关论文
共 50 条
  • [21] Low-Power Testing for Low-Power Devices
    Wen, Xiaoqing
    2010 IEEE 25TH INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT TOLERANCE IN VLSI SYSTEMS (DFT 2010), 2010, : 261 - 261
  • [22] An ultra low-power rf bipolar technology on glass
    Dekker, R
    Baltus, P
    van Deurzen, M
    vander Einden, W
    Maas, H
    Wagemans, A
    INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, : 921 - 923
  • [23] Low-power circuits and technology for wireless digital systems
    Kosonocky, S.V. (stevekos@us.ibm.com), 1600, IBM Corporation (47): : 2 - 3
  • [24] Low-Power Embedded ReRAM Technology for IoT Applications
    Ueki, M.
    Takeuchi, K.
    Yamamoto, T.
    Tanabe, A.
    Ikarashi, N.
    Saitoh, M.
    Nagumo, T.
    Sunamura, H.
    Narihiro, M.
    Uejima, K.
    Masuzaki, K.
    Furutake, N.
    Saito, S.
    Yabe, Y.
    Mitsuiki, A.
    Takeda, K.
    Hase, T.
    Hayashi, Y.
    2015 SYMPOSIUM ON VLSI TECHNOLOGY (VLSI TECHNOLOGY), 2015,
  • [25] VLSI CMOS TECHNOLOGY FOR LOW-POWER SENSOR APPLICATIONS
    SMAYLING, MC
    SOLID STATE IONICS, 1989, 34 (1-2) : 121 - 125
  • [26] Low-power circuits and technology for wireless digital systems
    Kosonocky, SV
    Bhavnagarwala, AJ
    Chin, K
    Gristede, GD
    Haen, AM
    Hwang, W
    Ketchen, MB
    Kim, S
    Knebel, DR
    Warren, KW
    Zyuban, V
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2003, 47 (2-3) : 283 - 298
  • [27] Implementing Low-Power Dynamic Adders in MTCMOS Technology
    Rastogi, Rumi
    Pandey, Sujata
    2015 2ND INTERNATIONAL CONFERENCE ON ELECTRONICS AND COMMUNICATION SYSTEMS (ICECS), 2015, : 782 - 786
  • [28] Technology-dependent transformations for low-power synthesis
    Panda, R
    Najm, FN
    DESIGN AUTOMATION CONFERENCE - PROCEEDINGS 1997, 1997, : 650 - 655
  • [29] Technology scaling and low-power data converter design
    Maloberti, Franco
    2007 PH.D RESEARCH IN MICROELECTRONICS AND ELECTRONICS, 2007, : 289 - 289
  • [30] TFSOI COMPLEMENTARY BICMOS TECHNOLOGY FOR LOW-POWER APPLICATIONS
    HUANG, WLM
    KLEIN, KM
    GRIMALDI, M
    RACANELLI, M
    RAMASWAMI, S
    TSAO, J
    FOERSTNER, J
    HWANG, BYC
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (03) : 506 - 512