Lithographic technology for microwave integrated circuits

被引：11

作者：

Shepherd, PR ^{[1
]}

Evans, PSA ^{[1
]}

Ramsey, BJ ^{[1
]}

Harrison, DJ ^{[1
]}

机构：

[1] BRUNEL UNIV,DEPT DESIGN,EGHAM,SURREY,ENGLAND

来源：

ELECTRONICS LETTERS | 1997年 / 33卷 / 06期

关键词：

microwave integrated circuits; lithography;

D O I：

10.1049/el:19970360

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs.

引用

页码：483 / 484

页数：2

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