Full ETSI E-Band Doubler, Quadrupler and 24 dBm Power Amplifier

被引:0
|
作者
Rodriguez, Melissa C. [1 ]
Tarazi, Jabra [1 ]
Dadello, Anna [1 ]
Convert, Emmanuelle R. O. [1 ]
McCulloch, MacCrae G. [1 ]
Mahon, Simon J. [1 ]
Hwang, Steve [1 ]
Mould, Rodney G. [1 ]
Fattorini, Anthony P. [1 ]
Young, Alan C. [1 ]
Harvey, James T. [1 ]
Parker, Anthony E. [2 ]
Heimlich, Michael C. [2 ]
Wang, Wen-Kai [3 ]
机构
[1] Macom Tech Solut, Sydney Design Ctr, 157 Walker St, Sydney, NSW 2060, Australia
[2] Macquarie Univ, Dept Engn, N Ryde, NSW 2109, Australia
[3] WIN Semicond, Tao Yuan Shien, Taiwan
基金
澳大利亚研究理事会;
关键词
E-band; frequency conversion; gallium arsenide; HEMTs; millimetre wave integrated circuits; power amplifiers; MW;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A GaAs pHEMT frequency doubler, a quadrupler and a power amplifier for E-band applications have been demonstrated to achieve useful output power and power added efficiency (PAE) over a wide bandwidth. The doubler and quadrupler circuits include medium power amplifiers to increase their gain and output power. The doubler has a measured output power greater than 15 dBm over the entire 15 GHz bandwidth of the European Telecommunications Standards Institute (ETSI) E-band specification. The quadrupler has similar output power over the ETSI E bands with a maximum output power of 19.2 dBm. The power amplifier has a maximum measured output power of 24.2 dBm (265 mW) and exceeds 23 dBm (200 mW) over the ETSI E bands. This amplifier has a measured small signal gain of 15 dB and the input and output return losses exceed 15 dB. Its measured PAE is above 8% across the ETSI E bands. This is the highest saturated output power (Psat) and PAE for a power amplifier spanning the full 71 to 86 GHz span of the ETSI E bands for any semiconductor system. Good agreement is demonstrated between measurement and simulation.
引用
收藏
页数:4
相关论文
共 50 条
  • [1] A 20dBm E-Band Power Amplifier in SiGe BiCMOS Technology
    Ben Yishay, Roee
    Carmon, Roi
    Katz, Oded
    Sheinman, Benny
    Elad, Danny
    2012 7TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2012, : 699 - 702
  • [2] A 20dBm E-Band Power Amplifier in SiGe BiCMOS Technology
    Ben Yishay, Roee
    Carmon, Roi
    Katz, Oded
    Sheinman, Benny
    Elad, Danny
    2012 42ND EUROPEAN MICROWAVE CONFERENCE (EUMC), 2012, : 1079 - 1082
  • [3] Design An ETSI E-Band
    Heimlich, Michael
    MICROWAVES & RF, 2013, 52 (10) : 54 - +
  • [4] An E-band CMOS frequency quadrupler with 1.7-dBm output power and 45-dB fundamental suppression
    Liao, Xiaofei
    Zhao, Dixian
    You, Xiaohu
    JOURNAL OF SEMICONDUCTORS, 2022, 43 (09)
  • [5] An E-band CMOS frequency quadrupler with 1.7-dBm output power and 45-dB fundamental suppression
    Xiaofei Liao
    Dixian Zhao
    Xiaohu You
    Journal of Semiconductors, 2022, 43 (09) : 34 - 40
  • [6] An 8-Way Combined E-Band Power Amplifier with 24 dBm Psat and 12% PAE in 0.12 μm SiGe
    Wagner, Eric C.
    Rebeiz, Gabriel M.
    2018 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM - IMS, 2018, : 1342 - 1344
  • [7] Design of an E-band Doherty Power amplifier
    Najmussadat, Md
    Ahamed, Raju
    Parveg, Dristy
    Varonen, Mikko
    Halonen, Kari A., I
    2018 14TH CONFERENCE ON PHD RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME 2018), 2018, : 145 - 148
  • [8] A SiGe-Based E-Band Power Amplifier with 17.7 dBm Output Power and 325-GHz GBW
    Furcian, Muhammad
    Ahmed, Faisal
    Stelzer, Andreas
    2014 9TH EUROPEAN MICROWAVE INTEGRATED CIRCUIT CONFERENCE (EUMIC), 2014, : 57 - 60
  • [9] Broadband E-band Power Amplifier MMIC based on an AlGaN/GaN HEMT Technology with 30 dBm Output Power
    Schwantuschke, Dirk
    Godejohann, Birte-Julia
    Breuer, Steffen
    Brueckner, Peter
    Mikulla, Michael
    Quay, Ruediger
    Ambacher, Oliver
    2016 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS), 2016, : 66 - 69
  • [10] A 3.1-dBm E-Band Truly Balanced Frequency Quadrupler in 22-nm FDSOI CMOS
    Vehring, Soenke
    Ding, Yaoshun
    Scholz, Philipp
    Gerfers, Friedel
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2020, 30 (12) : 1165 - 1168