Electrostatic Control and New Device Handling Consideration for MEMS Manufacturing Process

被引:0
|
作者
Chakkaew, Anusorn [1 ]
Titiroongruang, Wisut [1 ]
机构
[1] King Mongkuts Inst Technol, Fac Engn, Elect Res Ctr, Bangkok 10520, Thailand
关键词
Electrostatic Discharge; ESD; Personal Grounding; MEMS;
D O I
10.4028/www.scientific.net/AMR.378-379.659
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Electrostatic potential and electrostatic discharge (ESD) has been a factory issue for years, not only limited to semiconductor-based electronic devices, but there are evidences that new devices from emerging technologies become sensitive which are MEMS and NEMS. This paper describes new electrostatic control and device handling solutions for critical electrostatic control environment for MEMS manufacturing processes. There are experiments of personnel grounding devices, device handling materials, and evaluation of static control surfaces.
引用
收藏
页码:659 / 662
页数:4
相关论文
共 50 条
  • [41] Challenges of MEMS device characterization in engineering development and final manufacturing
    Maudie, T
    Miller, T
    Nielsen, R
    Wallace, D
    Ruehs, T
    Zehrbach, D
    1998 IEEE AUTOTESTCON PROCEEDINGS - IEEE SYSTEMS READINESS TECHNOLOGY CONFERENCE, 1998, : 164 - 170
  • [42] Analysis and design of an electrostatic MEMS microphone using the PolyMUMPs process
    Ryan Grixti
    Ivan Grech
    Owen Casha
    Jean Marie Darmanin
    Edward Gatt
    Joseph Micallef
    Analog Integrated Circuits and Signal Processing, 2015, 82 : 599 - 610
  • [43] Analysis and design of an electrostatic MEMS microphone using the PolyMUMPs process
    Grixti, Ryan
    Grech, Ivan
    Casha, Owen
    Darmanin, Jean Marie
    Gatt, Edward
    Micallef, Joseph
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2015, 82 (03) : 599 - 610
  • [44] Power Handling of Electrostatic MEMS Evanescent-Mode (EVA) Tunable Bandpass Filters
    Liu, Xiaoguang
    Katehi, Linda P. B.
    Chappell, William J.
    Peroulis, Dimitrios
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2012, 60 (02) : 270 - 283
  • [45] Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device
    Ma, Shenglin
    Ren, Kuili
    Xia, Yanming
    Yan, Jun
    Luo, Rongfeng
    Cai, Han
    Jin, Yufeng
    Ma, Mingjun
    Jin, Zhonghe
    Chen, Jing
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 983 - 987
  • [46] CONTROL OF MATERIAL HANDLING TRANSPORTER IN AUTOMATED MANUFACTURING
    HAN, MH
    MCGINNIS, LF
    IIE TRANSACTIONS, 1989, 21 (02) : 184 - 190
  • [47] Durability improvement of a cylinder head in consideration of manufacturing process
    Kim, B.
    Chang, H.
    Lee, K.
    Kim, C.
    INTERNATIONAL JOURNAL OF AUTOMOTIVE TECHNOLOGY, 2007, 8 (02) : 243 - 248
  • [48] Development of TMAH anisotropic etching manufacturing process for MEMS
    Tsaur, JY
    Yang, SI
    Du, CH
    Lin, ZS
    Huang, CT
    Lee, CK
    MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VI, 2000, 4174 : 142 - 153
  • [49] A new model for electrostatic MEMS with two free boundaries
    Kohlmann, Martin
    JOURNAL OF MATHEMATICAL ANALYSIS AND APPLICATIONS, 2013, 408 (02) : 513 - 524
  • [50] Electrostatic printing, a versatile manufacturing process for the electronics industries
    Detig, RH
    SOLID FREEFORM AND ADDITIVE FABRICATION-2000, 2000, 625 : 151 - 155