Electrostatic Control and New Device Handling Consideration for MEMS Manufacturing Process

被引：0

作者：

Chakkaew, Anusorn ^{[1
]}

Titiroongruang, Wisut ^{[1
]}

机构：

[1] King Mongkuts Inst Technol, Fac Engn, Elect Res Ctr, Bangkok 10520, Thailand

来源：

APPLIED MATERIALS AND ELECTRONICS ENGINEERING, PTS 1-2 | 2012年 / 378-379卷

关键词：

Electrostatic Discharge; ESD; Personal Grounding; MEMS;

D O I：

10.4028/www.scientific.net/AMR.378-379.659

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Electrostatic potential and electrostatic discharge (ESD) has been a factory issue for years, not only limited to semiconductor-based electronic devices, but there are evidences that new devices from emerging technologies become sensitive which are MEMS and NEMS. This paper describes new electrostatic control and device handling solutions for critical electrostatic control environment for MEMS manufacturing processes. There are experiments of personnel grounding devices, device handling materials, and evaluation of static control surfaces.

引用

页码：659 / 662

页数：4

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