Fast and Accurate Multiscale Electromagnetic Modeling Framework

被引：0
|
作者：
Chew, W. C. [1 ]
Cangellaris, A. C. [1 ]
Schutt-Aine, J. [1 ]
Braunisch, H.
Qian, Z. G.
Aydiner, A. A.
Ayguen, K.
Jiang, L. J.
Ma, Z. H.
Meng, L. L.
Naeem, M.
机构：
[1] U Illinois Urbana Champaign, Dept Elec Comp Eng, Urbana, IL 61801 USA
来源：
2013 17TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI) | 2013年
关键词：
fast; accurate; electromagnetics; modeling; multiscale; SiP; SoP; signal integrity; 3D IC; EQUIVALENCE PRINCIPLE; INTEGRAL-EQUATION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present an overview of challenge problems in electromagnetic modeling of highly complex and multi-scale structures found in 3D IC, SiP, SoC, and electronic packaging necessary for signal integrity assessment.
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页数：4
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