Transient and Crosstalk Analysis of Doped and Dielectric Inserted MLGNR Interconnects

被引:0
|
作者
Yeleti, Haritha [1 ]
Kumar, Mekala Girish [1 ]
Chandel, Rajeevan [2 ]
Agrawal, Yash [3 ]
机构
[1] Vidya Jyothi Inst Technol, Dept Elect & Commun Enginnering, Hyderabad, India
[2] Natl Inst Technol, Dept Elect & Commun Enginnering, Hamirpur, HP, India
[3] DA Inst Informat & Commun Technol, VLSI & Embedded R Grp, Gandhinagar, Gujarat, India
关键词
Crosstalk; Delay; GNR; Interconnects;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the present work, performance of normal multilayer graphene nanoribbon (NMLGNR), doped MLGNR (DMLGNR) and dielectric inserted MLGNR (DiMLGNR) are analysed using coupled line interconnect system. The transient and crosstalk analysis of NMLGNR, DMLGNR and DiMLGNR interconnects are presented. By performing transient analysis, the average propagation delay for DiMLGNR exhibits the best performance amongst the three types of interconnect-systems under consideration. The crosstalk delay of DiMLGNR interconnect is 62.7% and 25.7% lesser compared to that of NMLGNR and DMLGNR interconnects respectively.
引用
收藏
页数:3
相关论文
共 50 条
  • [41] Modeling and performance analysis of coupled multilayer graphene nanoribbon (MLGNR) interconnects with intercalation doping
    Zou, Fa
    Pan, Zhongliang
    Xu, Peng
    MICROELECTRONICS JOURNAL, 2023, 141
  • [42] Crosstalk analysis of carbon nanotube bundle interconnects
    Zhang, Kailiang
    Tian, Bo
    Zhu, Xiaosong
    Wang, Fang
    Wei, Jun
    NANOSCALE RESEARCH LETTERS, 2012, 7
  • [43] Crosstalk analysis of carbon nanotube bundle interconnects
    School of Electronics Information Engineering, Tianjin Key Laboratory of Film Electronic and Communication Devices, Tianjin University of Technology, Tianjin, 300384, China
    不详
    Nanoscale Res. Lett., (1-5):
  • [44] Crosstalk Analysis of Triangular CNT Bundle Interconnects
    Sathyakam, P. Uma
    Bhattacharjee, Shatarupa
    Raj, Shubham
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (12) : 7017 - 7025
  • [45] Crosstalk Analysis of Triangular CNT Bundle Interconnects
    P. Uma Sathyakam
    Shatarupa Bhattacharjee
    Shubham Raj
    Journal of Electronic Materials, 2021, 50 : 7017 - 7025
  • [46] Crosstalk analysis of carbon nanotube bundle interconnects
    Kailiang Zhang
    Bo Tian
    Xiaosong Zhu
    Fang Wang
    Jun Wei
    Nanoscale Research Letters, 7
  • [47] Crosstalk analysis and repeater insertion in crosstalk aware coupled VLSI interconnects
    Kaushik, Brajesh Kumar
    Sarkar, Sankar
    Agarwal, R. P.
    Joshi, R. C.
    MICROELECTRONICS INTERNATIONAL, 2006, 23 (03) : 55 - 63
  • [48] Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path
    K. Narasimha Reddy
    Manoj Kumar Majumder
    Brajesh Kumar Kaushik
    Journal of Computational Electronics, 2014, 13 : 639 - 646
  • [49] Transient Analysis of Crosstalk Noise Effects in SWCNT Bundle On-Chip Interconnects Using MRTD Technique
    Gugulothu, Bhaskar
    Bhukya, Rajendra Naik
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2021, 10 (10)
  • [50] Delay uncertainty in MLGNR interconnects under process induced variations of width, doping, dielectric thickness and mean free path
    Reddy, K. Narasimha
    Majumder, Manoj Kumar
    Kaushik, Brajesh Kumar
    JOURNAL OF COMPUTATIONAL ELECTRONICS, 2014, 13 (03) : 639 - 646