Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process

被引：2

作者：

Rusdi, M. S. ^{[1
]}

Abdullab, M. Z. ^{[2
]}

Aziz, M. S. Abdul ^{[1
]}

Abdullah, M. K. ^{[3
]}

Bakar, A. A. ^{[3
]}

Abd Samad, M. H. S. ^{[4
]}

Rethinasamy, P. ^{[4
]}

Veerasamy, Sivakumar ^{[4
]}

Khor, C. Y. ^{[5
]}

机构：

[1] Univ Sains Malaysia, Sch Mech Engn, Engn Campus, Nibongtebal 14300, Penang, Malaysia

[2] Univ Sains Malaysia, Sch Aerosp Engn, Engn Campus, Nibongtebal 14300, Penang, Malaysia

[3] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Engn Campus, Nibongtebal 14300, Penang, Malaysia

[4] Celest Malaysia Sdn Bhd, Plot 15,Jalan Hitech 2-3 Phase 1,Kulim Hitech Pk, Kulim 09000, Malaysia

[5] Univ Malaysia Perlis, Fac Engn Technol, Mech Dept, Aras 1,Blok S2,Kampus UniCITI Alam, Padang Besar 02100, Perlis, Malaysia

来源：

REGIONAL CONFERENCE ON MATERIALS AND ASEAN MICROSCOPY CONFERENCE 2017 (RCM & AMC 2017) | 2018年 / 1082卷

关键词：

SURFACE;

D O I：

10.1088/1742-6596/1082/1/012057

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The high requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. However, during stencil printing stage contributes major concern compared to other stages in Surface Mount Technology (SMT). Unsuitable process parameters can cause the soldering defects that can lead to product failure in further processes in the production line. An investigation has been conducted to predict the real-time observation of solder paste Sn96.5Ag3.0Cu0.5 (SAC305) filling process into stencil apertures as well as print quality in stencil printing by using Computational Fluid Dynamics (CFD) approach. A 3D-Dimensional stencil printing model was developed and simulated in ANSYS Fluent 17 of different angles. It is found that squeegee angle 60 degrees to 80 degrees has potential to obtain the good print quality of solder paste.

引用

页数：6

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