An efficient 3D IC partitioning approach using satin bowerbird optimization for reduced TSV count and improved heat dissipation

被引:1
|
作者
Roy, Sharadindu [1 ]
Banerjee, Siddhartha [2 ]
机构
[1] Sonarpur Mahavidyalaya, Dept Comp Sci, Sonarpur, West Bengal, India
[2] Ramakrishna Mission Residential Coll Autonomous, Dept Comp Sci, Narendrapur, West Bengal, India
来源
ENGINEERING RESEARCH EXPRESS | 2023年 / 5卷 / 04期
关键词
3D IC partitioning; satin bowerbird optimization; Multi-objective optimization; through silicon vias; power density; THROUGH-SILICON;
D O I
10.1088/2631-8695/ad0928
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Net list partitioning achieves paramount importance in the physical architecture design step of Three Dimensional (3D) Very Large Scale Integrated (VLSI) circuits. The performance of all subsequent steps like floor layout, placement, pin assignment, and routing in the physical architecture design of the VLSI circuit are heavily affected by the outcomes of partitioning steps. Wire length between gates is reduced by 3D Integrated Circuit (IC) due to compact footprint as well as vertical inter connections among dies. This reduced wire length in turns responsible for less energy consumption and reduced connection delays. In this paper, Satin Bowerbird Optimization (SBO) is applied to solve 3D IC partitioning challenges. The suggested 3D IC partitioning technique is aimed at reducing the number of Through Silicon Vias (TSV) and measurements have also been taken to reduce heat dissipation. The presence of a significant amount of TSVs expands the chip area. 3D ICs have considerably greater densities of power because of advances in the technology and a vastly increased variety of components with high frequency. The heat generated by the used power has an impact on the performance and dependability of the chip. In this experiment, SBO is used as a multi-objective optimization method to achieve two objectives simultaneously - TSV count minimization and heat dissipation reduction. The performance of the suggested SBO - based approach is assessed utilizing the Giga Scale Research Center (GSRC) benchmark circuits. The applicability of the suggested technique is judged by comparing the outcomes with thermal-aware multilevel hyper-graph partitioning method. The findings of the comparison reveal that the suggested technique outperforms the thermal-aware multilevel hyper-graph partitioning approach by lowering the number of TSV count, maximum area requirement, and power density by 16.99%, 9.94% and 29.10% respectively. The performance of the experiment is also compared with existing Simulated Annealing and Tabu search based techniques. In both cases, the proposed method achieves better result by lowering TSV by 26.03% and 27.31%, and reducing area by 6.59% and 6.59%, respectively.
引用
收藏
页数:12
相关论文
共 50 条
  • [31] Method and experimental investigation of surface heat dissipation measurement using 3D thermography
    Schmoll, Robert
    Schramm, Sebastian
    Breitenstein, Tom
    Kroll, Andreas
    JOURNAL OF SENSORS AND SENSOR SYSTEMS, 2022, 11 (01) : 41 - 49
  • [32] Descending Order Thermal Distribution Partitioning Algorithm for Flip-Chip Packaged 3-D ICs to Improve Heat Sinking and Reduce TSV Count
    Bhat, Kavya
    Jayagowri, R.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (07): : 1148 - 1157
  • [33] PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
    Pak, Jun So
    Kim, Joohee
    Cho, Jonghyun
    Kim, Kiyeong
    Song, Taigon
    Ahn, Seungyoung
    Lee, Junho
    Lee, Hyungdong
    Park, Kunwoo
    Kim, Joungho
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (02): : 208 - 219
  • [34] Efficient 3D Placement of a UAV Using Particle Swarm Optimization
    Shakhatreh, Hazim
    Khreishah, Abdallah
    Alsarhan, Ayoub
    Khalil, Issa
    Sawalmeh, Ahmad
    Othman, Noor Shamsiah
    2017 8TH INTERNATIONAL CONFERENCE ON INFORMATION AND COMMUNICATION SYSTEMS (ICICS), 2017, : 258 - 263
  • [35] A high efficient integrated heat dissipation systems with CNT array based heat lines and microchannel heat sink in 3D ICs
    Sun, Yunna
    Lee, Seung-lo
    Xu, Qiu
    Luo, Jiangbo
    Li, Hongfang
    Wang, Yan
    Ding, Guifu
    Zhao, Xiaolin
    PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 709 - 713
  • [36] 3D preform shape optimization in forging using reduced basis techniques
    Thiyagarajan, N
    Grandhi, RV
    ENGINEERING OPTIMIZATION, 2005, 37 (08) : 797 - 811
  • [37] Cascade2D: A Design-Aware Partitioning Approach to Monolithic 3D IC with 2D Commercial Tools
    Chang, Kyungwook
    Sinha, Saurabh
    Cline, Brian
    Southerland, Raney
    Doherty, Michael
    Yeric, Greg
    Lim, Sung Kyu
    2016 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2016,
  • [38] 3D Stacked IC Demonstration using a Through Silicon Via First Approach
    Van Olmen, J.
    Mercha, A.
    Katti, G.
    Huyghebaert, C.
    Van Aelst, J.
    Seppala, E.
    Chao, Zhao
    Armini, S.
    Vaes, J.
    Teixeira, R. Cotrin
    Van Cauwenberghe, M.
    Verdonck, P.
    Verhemeldonck, K.
    Jourdain, A.
    Ruythooren, W.
    de ten Broeck, M. de Potter
    Opdebeeck, A.
    Chiarella, T.
    Parvais, B.
    Debusschere, I.
    Hoffmann, T. Y.
    De Wachter, B.
    Dehaene, W.
    Stucchi, M.
    Rakowski, M.
    Soussan, Ph.
    Cartuyvels, R.
    Beyne, E.
    Biesemans, S.
    Swinnen, B.
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST, 2008, : 603 - +
  • [39] A Novel Way of Comparing Protein 3D Structure Using Graph Partitioning Approach
    Angadi, Ulavappa B.
    Chaturvedi, Krishna Kumar
    Srivastava, Sudhir
    Rai, Anil
    IEEE-ACM TRANSACTIONS ON COMPUTATIONAL BIOLOGY AND BIOINFORMATICS, 2021, 18 (04) : 1361 - 1368
  • [40] Enhanced Heat Dissipation of WLEDs Packaged Using 3D Substrate With Geopolymer/BN Paste
    Sun, Qinglei
    Li, Jianing
    Hao, Ziliang
    Li, Zheng
    Cui, Can
    Wang, Yijing
    Chen, Qiaoyu
    Li, Yan
    Hao, Liang
    IEEE PHOTONICS TECHNOLOGY LETTERS, 2024, 36 (04) : 262 - 265