Reliability challenges in Forksheet Devices

被引:0
|
作者
Bury, E. [1 ]
Vandemaele, M. [1 ]
Franco, J. [1 ]
Chasin, A. [1 ]
Tyaginov, S. [1 ]
Vandooren, A. [1 ]
Ritzenthaler, R. [1 ]
Mertens, H. [1 ]
Fortuny, J. Diaz [1 ]
Horiguchi, N. [1 ]
Linten, D. [1 ]
Kaczer, B. [1 ]
机构
[1] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
关键词
Forksheet FETs; FSH; BDI; Nanosheet FETs; NSH; hot-carrier degradation; HCD; trapping; oxide defects; FET arrays; bottom dielectric isolation;
D O I
10.1109/IRPS48203.2023.10118269
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The forksheet (FSH) device architecture is a possible candidate towards continued logic cell downscaling. It consists of vertically stacked n- and ptype sheets at opposing sides of a dielectric wall. In this work, we overview the time-0 and time-dependent performance of n and p-type FSH field-effect transistors co-integrated with nanosheets (NSH) in individual wafers. A separate assessment of dedicated capacitors yields indications of a non-negligible effect of negative fixed charges trapped in low-temperature deposited SiO2, currently used as dielectric wall liner. Finally, we evaluate the impact of using a bottom dielectric isolation (BDI) instead of a junction-based electrical isolation of the sheets from the substrate.
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页数:8
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