Novel Reconfigurable Transistor With Extended Source/Drain Beyond 3 nm Technology Node

被引:1
|
作者
Ye, Hongbo [1 ]
Hu, Junfeng [2 ]
Liu, Ziyu [3 ]
Wang, Chao [2 ]
Li, Xiaojin [2 ]
Shi, Yanling [2 ]
Mao, Zhigang [1 ]
Sun, Yabin [2 ,4 ]
机构
[1] Shanghai Jiao Tong Univ, Dept Micro Nano Elect, Shanghai 200240, Peoples R China
[2] East China Normal Univ, Dept Elect Engn, Shanghai 200241, Peoples R China
[3] Fudan Univ, Sch Microelect, Shanghai 200433, Peoples R China
[4] East China Normal Univ, Chongqing Key Lab Precis Opt, Chongqing Inst, Chongqing 401120, Peoples R China
基金
中国国家自然科学基金;
关键词
Tunneling; Silicon; Silicides; Nickel alloys; Logic gates; Electrostatic discharges; Electrons; Extended source/drain; line tunneling; reconfigurable field-effect transistor (RFET); FIELD-EFFECT TRANSISTOR; NICKEL-SILICIDE; PERFORMANCE; NANOWIRES; IMPACT; MOSFET; LAYER; TFET; GE; SI;
D O I
10.1109/TED.2024.3359581
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, a novel stacked nanosheetreconfigurable field effect transistor with extendedsource/drain (ESD-NSRFET) is proposed to improve ON-current (I-ON), where an additional extended source/drainis intersected between the vertically stacked nanosheets.Compared to the conventional nanosheet RFET (NSRFET),I-ON of proposed ESD-NSRFET with 4 nm extended sourceis demonstrated to improve by 176x and 80xfor n-type andp-type program, respectively. Geometry parameters likeextended source/drain length L-ESD, nanosheet widthWNS,and nanosheet thickness T-NS are investigated in point of I-ON. Considering the trade-off between increased tunnelingstrength and degraded parasitic source resistance, LESD in ESD-NSRFET should be carefully designed to obtainoptimal current. The underlying physical mechanism isalso discussed in detail.
引用
收藏
页码:2265 / 2270
页数:6
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