Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits

被引：3
|
作者：
Rich, Dennis [1 ]
Kasperovich, Anna [1 ]
Malakoutian, Mohamadali [1 ]
Radway, Robert M. [1 ]
Hagiwara, Shiho [2 ]
Yoshikawa, Takahide [2 ]
Chowdhury, Srabanti [1 ]
Mitra, Subhasish [3 ]
机构：
[1] Stanford Univ, Elect Engn, Stanford, CA 94305 USA
[2] Fujitsu Res, Kawasaki, Kanagawa, Japan
[3] Stanford Univ, Elect Engn & Comp Sci, Stanford, CA USA
来源：
2023 60TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, DAC | 2023年
关键词：
thermal management; 3D integrated circuits; back-end-of-line thermal conductivity; DIELECTRIC-CONSTANT; FILMS;
D O I：
10.1109/DAC56929.2023.10247815
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
引用
收藏
页数：6
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