Review-Electroforming Process for Microsystems Fabrication

被引:2
|
作者
Rai, Prince Kumar [1 ]
Gupta, Ankur [1 ]
机构
[1] Indian Inst Technol Jodhpur, Dept Mech Engn, Jodhpur 342030, Rajasthan, India
关键词
ULTRASONIC AGITATION; FE-NI; THICKNESS UNIFORMITY; ADHESION STRENGTH; MASS-TRANSFER; PULSE; LIGA; ELECTRODEPOSITION; NICKEL; LAYER;
D O I
10.1149/1945-7111/ad0d16
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Being an unconventional technique of additive micro-manufacturing, electroforming has garnered significant interest from various industrial sectors because of its capability to offer advanced micro-manufacturing competences with high precision in achieving dimensional uniformity and replication accuracy at a small scale. This paper reports a comprehensive review of the electroforming process as a microsystem fabrication technique. This process is superior to 3D printing, stereolithography, selective laser sintering, physical and chemical vapor deposition, etc. in many aspects due to its unique properties. It can deposit a variety of metals and alloys, including precious metals, making it appropriate for various applications in the microfabrication domain. This article covers the fundamental aspects of electroforming, its history, the current state-of-the-art advancements, the modeling associated with it, and its importance in an industrial context. Additionally, the article discusses the advantages and limitations of this technique and their respective microsystem applications. Finally, it concludes with a discussion on the future prospects and potential advancements in the field of electroforming, contributing to the development of microsystems. Review covering advancements in electroforming tailored to microfabrication devices.Coverage of industrial applications of electroforming.Highlights of the importance of data-driven decision-making and process optimization.Significance and challenges of electroforming modelling.Industry 4.0 implementation and its benefits to electroforming industries.
引用
收藏
页数:25
相关论文
共 50 条
  • [31] THE ELECTROFORMING PROCESS IN MIM DIODES
    BLESSING, R
    PAGNIA, H
    SOTNIK, N
    THIN SOLID FILMS, 1981, 85 (02) : 119 - 128
  • [32] FABRICATION OF CERAMIC HIGH TEMPERATURE MICROSYSTEMS
    Kellie, Benjamin
    Prakash, Shaurya
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 11, 2012, : 281 - 285
  • [33] Fabrication and packaging of optical components and microsystems
    Rantala, JT
    Aikio, J
    Karioja, P
    Descour, MR
    Kopola, H
    Lammasniemi, J
    MICRO-OPTO-ELECTRO-MECHANICAL SYSTEMS, 2000, 4075 : 140 - 149
  • [34] Fabrication challenges for indium phosphide microsystems
    Siwak, N. P.
    Fan, X. Z.
    Ghodssi, R.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2015, 25 (04)
  • [35] Fabrication of metal matrix composite by electroforming technique
    Kuboyama, K
    Ishibashi, T
    Uchio, S
    INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 2001, 16 (1-3): : 67 - 73
  • [36] Design rules for electroforming in the LIGA process
    Drese, KS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (06) : D39 - D45
  • [37] THEORETICAL-ANALYSIS OF THE ELECTROFORMING PROCESS
    MCGEOUGH, JA
    RASMUSSEN, H
    JOURNAL OF MECHANICAL ENGINEERING SCIENCE, 1981, 23 (03): : 113 - 120
  • [38] Fabrication of microfluidic chip mold based on through-mask electrochemical etching and micro electroforming process
    Du, Liqun
    Zhao, Wenjun
    Zhai, Ke
    Song, Chang
    Li, Qingfeng
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2018, 28 (07)
  • [39] THICK-PHOTORESIST ELECTROFORMING PROCESS
    MEARIG, SG
    PLATING AND SURFACE FINISHING, 1983, 70 (01): : 32 - 32
  • [40] Electroforming a process for macro/nano manufacturing
    Hussain M.S.
    International Journal of Nanomanufacturing, 2010, 6 (1-4) : 324 - 333