Design rules for electroforming in the LIGA process

被引:6
|
作者
Drese, KS [1 ]
机构
[1] Inst Mikrotech Mainz GmbH, D-55133 Mainz, Germany
关键词
D O I
10.1149/1.1739220
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Design rules for electroforming that avoid design flaws are presented. The physical background and interlink to the perceptions in the literature that sum up those rules are outlined. The characteristic dimensionless groups that are needed to identify the regime at which each electroforming process is run are summarized so that the relevance of each design rule can be determined. It is also shown how image possessing helps to visualize design flaws quickly, i.e., without the effort of a full simulation. All design rules do not rely on the details of the galvanic bath, but only on the knowledge of the flow regime and plating regime. Thus a first step to a simple design evaluation for the nonexpert is outlined. (C) 2004 The Electrochemical Society.
引用
收藏
页码:D39 / D45
页数:7
相关论文
共 50 条
  • [1] A new electroforming technology in aid of pressure for Liga process
    Yang, HH
    Tsai, TS
    Chein, R
    Chang, CH
    Wu, JC
    DTIP 2003: DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2003, 2003, : 275 - 280
  • [2] New electroforming technology pressure aid for LIGA process
    T.-H. Tsai
    H. Yang
    R. Chein
    Microsystem Technologies, 2004, 10 : 351 - 356
  • [3] New electroforming technology pressure aid for LIGA process
    Tsai, TH
    Yang, H
    Chein, R
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2004, 10 (05): : 351 - 356
  • [4] New electroforming technology pressure aid for LIGA process
    T. -H. Tsai
    H. Yang
    R. Chein
    Microsystem Technologies, 2004, 10 (5) : 351 - 356
  • [5] Improvement of thickness uniformity in nickel electroforming for the LIGA process
    Yang, HH
    Kang, SW
    INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2000, 40 (07): : 1065 - 1072
  • [6] DESIGN RULES AND TEST OF ELECTROSTATIC MICROMOTORS MADE BY THE LIGA PROCESS
    WALLRABE, U
    BLEY, P
    KREVET, B
    MENZ, W
    MOHR, J
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1994, 4 (01) : 40 - 45
  • [7] Microcomposite electroforming for LIGA technology
    Chou, MC
    Yang, H
    Yeh, SH
    MICROSYSTEM TECHNOLOGIES, 2001, 7 (01) : 36 - 39
  • [8] Microcomposite electroforming for LIGA technology
    M.-C. Chou
    H. Yang
    S.-H. Yeh
    Microsystem Technologies, 2001, 7 : 36 - 39
  • [9] Copper Electroforming for UV LIGA Technology
    Li, Hanyan
    Li, Xinghui
    Bai, Guodong
    Feng, Jinjun
    IEEE INTERNATIONAL VACUUM ELECTRONICS CONFERENCE, 2014, : 245 - 246
  • [10] NEW MICROELECTRODES FOR THE INVESTIGATION OF THE ELECTROFORMING OF LIGA MICROSTRUCTURES
    LEYENDECKER, K
    BACHER, W
    STARK, W
    THOMMES, A
    ELECTROCHIMICA ACTA, 1994, 39 (8-9) : 1139 - 1143