共 50 条
- [1] A new electroforming technology in aid of pressure for Liga process DTIP 2003: DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS 2003, 2003, : 275 - 280
- [2] New electroforming technology pressure aid for LIGA process Microsystem Technologies, 2004, 10 : 351 - 356
- [3] New electroforming technology pressure aid for LIGA process MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2004, 10 (05): : 351 - 356
- [5] Improvement of thickness uniformity in nickel electroforming for the LIGA process INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2000, 40 (07): : 1065 - 1072
- [9] Copper Electroforming for UV LIGA Technology IEEE INTERNATIONAL VACUUM ELECTRONICS CONFERENCE, 2014, : 245 - 246